Invention Application
- Patent Title: Tape rule housing structure
- Patent Title (中): 磁带规则住房结构
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Application No.: US11258724Application Date: 2005-10-25
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Publication No.: US20060075653A1Publication Date: 2006-04-13
- Inventor: Shih-Lin Lee
- Applicant: Shih-Lin Lee
- Main IPC: G01B3/10
- IPC: G01B3/10

Abstract:
The outer surface of a tape rule proper of an improved tape rule housing structure is adhered with a leather or fibrous cloth using a binder so that the user is easy to grip without the worry of slipping, and also contributes to enhancing visually appealing look of the tape rule. The leather or fibrous cloth can be adhered to any portion on the surface of the tape rule such as the juncture and edges of the housing.
Information query