发明申请
- 专利标题: Method for magnetron sputter deposition
- 专利标题(中): 磁控溅射沉积方法
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申请号: US10962772申请日: 2004-10-12
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公开(公告)号: US20060076231A1公开(公告)日: 2006-04-13
- 发明人: Ronghua Wei
- 申请人: Ronghua Wei
- 申请人地址: US TX San Antonio
- 专利权人: Southwest Research Institute
- 当前专利权人: Southwest Research Institute
- 当前专利权人地址: US TX San Antonio
- 主分类号: C23C14/00
- IPC分类号: C23C14/00 ; C23C14/32
摘要:
A method for depositing a coating on an interior surface of a hollowed workpiece. The method comprises providing the hollowed workpiece in a vacuum chamber, the hollowed workpiece comprising an interior surface substantially defining a bore having a longitudinal axis; positioning a magnetron within thed bore along substantially the length of said longitudinal axis and substantially radially equidistant from the interior surface, said magnetron comprising an external sputter target material; and, generating a circumferential magnetic field about the sputter target material for a time and under sputter deposition conditions effective to produce an interior surface comprising a substantially uniform coating comprising said sputter target material.
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