发明申请
- 专利标题: Methods of fabricating interferometric modulators by selectively removing a material
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申请号: US11090552申请日: 2005-03-25
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公开(公告)号: US20060076311A1公开(公告)日: 2006-04-13
- 发明人: Ming-Hau Tung , Philip Floyd , Brian Arbuckle
- 申请人: Ming-Hau Tung , Philip Floyd , Brian Arbuckle
- 主分类号: B29D11/00
- IPC分类号: B29D11/00
摘要:
Methods for making MEMS devices such as interferometric modulators involve selectively removing a sacrificial portion of a material to form an internal cavity, leaving behind a remaining portion of the material to form a post structure. The material may be blanket deposited and selectively altered to define sacrificial portions that are selectively removable relative to the remaining portions. Alternatively, a material layer can be laterally recessed away from openings in a covering layer. These methods may be used to make unreleased and released interferometric modulators.
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