公开(公告)号：US20090219605A1

公开(公告)日：2009-09-03

申请号：US12463312

申请日：2009-05-08

申请人： Wen-Jian Lin ,  Brian Arbuckle ,  Brian Gally ,  Philip Floyd ,  Lauren Palmateer

发明人： Wen-Jian Lin ,  Brian Arbuckle ,  Brian Gally ,  Philip Floyd ,  Lauren Palmateer

IPC分类号： G02B26/00

CPC分类号： G02B26/001 ,  B81B7/0012 ,  B81B2201/045

摘要： A first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrode and the sacrificial layer. The supports are formed in the first openings, and then a second electrode is formed on the sacrificial layer and the supports, thus forming a micro electro mechanical system structure. Afterward, an adhesive is used to adhere and fix a protection structure to the substrate for forming a chamber to enclose the micro electro mechanical system structure, and at least one second opening is preserved on sidewalls of the chamber. A release etch process is subsequently employed to remove the sacrificial layer through the second opening in order to form cavities in an optical interference reflection structure. Finally, the second opening is closed to seal the optical interference reflection structure between the substrate and the protection structure.

摘要翻译： 第一电极和牺牲层依次形成在基板上，然后在第一电极和牺牲层中形成用于形成支撑件的第一开口。 支撑件形成在第一开口中，然后在牺牲层和支撑件上形成第二电极，从而形成微机电系统结构。 之后，使用粘合剂将保护结构粘附并固定到基底上以形成腔室以包围微机电系统结构，并且至少一个第二开口保留在腔室的侧壁上。 随后采用释放蚀刻工艺以通过第二开口去除牺牲层，以便在光学干涉反射结构中形成空腔。 最后，关闭第二个开口以密封衬底和保护结构之间的光学干涉反射结构。

公开(公告)号：US20060077145A1

公开(公告)日：2006-04-13

申请号：US11074253

申请日：2005-03-07

申请人： Philip Floyd ,  Brian Arbuckle

发明人： Philip Floyd ,  Brian Arbuckle

IPC分类号： G09G3/34

CPC分类号： B81C1/00269 ,  B81B2201/042 ,  B81C2203/019 ,  B81C2203/032 ,  G02B26/001

摘要： Described herein are systems, devices, and methods relating to packaging electronic devices, for example, microelectromechanical systems (MEMS) devices, including optical modulators such as interferometric optical modulators. The packaging system disclosed herein comprises a patterned spacer that, in some embodiments, is fabricated using thin-film methods. In some embodiments, the spacer together with a substrate and backplate package an electronic device.

摘要翻译： 这里描述了与包装电子设备有关的系统，设备和方法，例如包括光学调制器（例如干涉式光学调制器）的微机电系统（MEMS）设备。 本文公开的包装系统包括在一些实施例中使用薄膜方法制造的图案化间隔物。 在一些实施例中，间隔件与基板和背板一起包装电子装置。

公开(公告)号：US20060076311A1

公开(公告)日：2006-04-13

申请号：US11090552

申请日：2005-03-25

申请人： Ming-Hau Tung ,  Philip Floyd ,  Brian Arbuckle

发明人： Ming-Hau Tung ,  Philip Floyd ,  Brian Arbuckle

IPC分类号： B29D11/00

CPC分类号： B81C1/00174 ,  B81B2201/047 ,  B81B2203/0181 ,  B81C1/00182 ,  B81C2201/0109 ,  G02B26/001

摘要： Methods for making MEMS devices such as interferometric modulators involve selectively removing a sacrificial portion of a material to form an internal cavity, leaving behind a remaining portion of the material to form a post structure. The material may be blanket deposited and selectively altered to define sacrificial portions that are selectively removable relative to the remaining portions. Alternatively, a material layer can be laterally recessed away from openings in a covering layer. These methods may be used to make unreleased and released interferometric modulators.

公开(公告)号：US20060067649A1

公开(公告)日：2006-03-30

申请号：US11203613

申请日：2005-08-12

申请人： Ming-Hau Tung ,  Brian Arbuckle ,  Philip Floyd ,  William Cummings

发明人： Ming-Hau Tung ,  Brian Arbuckle ,  Philip Floyd ,  William Cummings

IPC分类号： G02B6/00

CPC分类号： G02B26/001

摘要： A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

公开(公告)号：US20060065366A1

公开(公告)日：2006-03-30

申请号：US11045588

申请日：2005-01-28

申请人： William Cummings ,  Brian Arbuckle ,  Philip Floyd

发明人： William Cummings ,  Brian Arbuckle ,  Philip Floyd

IPC分类号： C03C25/68 ,  H01L21/306

CPC分类号： H01L21/67069

摘要： An etching chamber is configured to support a MEMS substrate within the chamber. The etching chamber is configured to be relatively easy to move and attach to an etch station that includes a source of vapor or gaseous etchant, a source of purge gas and/or a vacuum source. The portable etching chamber may facilitate a process for etching the MEMS substrate contained therein. For example, a MEMS substrate in such an etching chamber may be etched by connecting the chamber into an etch station and exposing the MEMS substrate to an etchant in order to etch the MEMS substrate. The substrate can be moved to or from the etch station within the portable etching chamber. In preferred embodiments, the MEMS substrate is an interferometric modulator and the etchant is XeF2.

摘要翻译： 蚀刻室被配置为支撑腔室内的MEMS衬底。 蚀刻室被配置为相对容易地移动并附着到包括蒸气源或气体蚀刻剂源，净化气体源和/或真空源的蚀刻站。 便携式蚀刻室可以有助于蚀刻其中包含的MEMS基板的工艺。 例如，可以通过将腔室连接到蚀刻站中来蚀刻这种蚀刻室中的MEMS衬底，并将MEMS衬底暴露于蚀刻剂以蚀刻MEMS衬底。 衬底可以移动到便携式蚀刻室内或从蚀刻站移动。 在优选实施例中，MEMS衬底是干涉式调制器，蚀刻剂是XeF 2。

公开(公告)号：US07532385B2

公开(公告)日：2009-05-12

申请号：US10807128

申请日：2004-03-24

申请人： Wen-Jian Lin ,  Brian Arbuckle ,  Brian Gally ,  Philip Floyd ,  Lauren Palmateer

发明人： Wen-Jian Lin ,  Brian Arbuckle ,  Brian Gally ,  Philip Floyd ,  Lauren Palmateer

IPC分类号： G02B26/00 ,  H01L21/00

CPC分类号： G02B26/001 ,  B81B7/0012 ,  B81B2201/045

摘要： A first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrode and the sacrificial layer. The supports are formed in the first openings, and then a second electrode is formed on the sacrificial layer and the supports, thus forming a micro electro mechanical system structure. Afterward, an adhesive is used to adhere and fix a protection structure to the substrate for forming a chamber to enclose the micro electro mechanical system structure, and at least one second opening is preserved on sidewalls of the chamber. A release etch process is subsequently employed to remove the sacrificial layer through the second opening in order to form cavities in an optical interference reflection structure. Finally, the second opening is closed to seal the optical interference reflection structure between the substrate and the protection structure.

摘要翻译： 第一电极和牺牲层依次形成在基板上，然后在第一电极和牺牲层中形成用于形成支撑件的第一开口。 支撑件形成在第一开口中，然后在牺牲层和支撑件上形成第二电极，从而形成微机电系统结构。 之后，使用粘合剂将保护结构粘附并固定到基底上以形成腔室以包围微机电系统结构，并且至少一个第二开口保留在腔室的侧壁上。 随后采用释放蚀刻工艺以通过第二开口去除牺牲层，以便在光学干涉反射结构中形成空腔。 最后，关闭第二个开口以密封衬底和保护结构之间的光学干涉反射结构。

公开(公告)号：US07385744B2

公开(公告)日：2008-06-10

申请号：US11476998

申请日：2006-06-28

申请人： Lior Kogut ,  Ming-Hau Tung ,  Brian Arbuckle

发明人： Lior Kogut ,  Ming-Hau Tung ,  Brian Arbuckle

IPC分类号： G02B26/08 ,  G02B26/00

CPC分类号： B81B3/0072

摘要： A microelectromechanical (MEMS) device includes a functional layer including a first material and a deformable layer including a second material. The second material is different from the first material. The deformable layer is mechanically coupled to the functional layer at a junction. The functional layer and the deformable layer have substantially equal internal stresses at the junction.

摘要翻译： 微机电（MEMS）装置包括包括第一材料和包括第二材料的可变形层的功能层。 第二种材料与第一种材料不同。 可变形层在结处机械耦合到功能层。 功能层和可变形层在接合处具有基本相等的内应力。

公开(公告)号：US08004736B2

公开(公告)日：2011-08-23

申请号：US12463312

申请日：2009-05-08

申请人： Wen-Jian Lin ,  Brian Arbuckle ,  Brian Gally ,  Philip Floyd ,  Lauren Palmateer

发明人： Wen-Jian Lin ,  Brian Arbuckle ,  Brian Gally ,  Philip Floyd ,  Lauren Palmateer

IPC分类号： G02B26/00

CPC分类号： G02B26/001 ,  B81B7/0012 ,  B81B2201/045

摘要： A first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrode and the sacrificial layer. The supports are formed in the first openings, and then a second electrode is formed on the sacrificial layer and the supports, thus forming a micro electro mechanical system structure. Afterward, an adhesive is used to adhere and fix a protection structure to the substrate for forming a chamber to enclose the micro electro mechanical system structure, and at least one second opening is preserved on sidewalls of the chamber. A release etch process is subsequently employed to remove the sacrificial layer through the second opening in order to form cavities in an optical interference reflection structure. Finally, the second opening is closed to seal the optical interference reflection structure between the substrate and the protection structure.

摘要翻译： 第一电极和牺牲层依次形成在基板上，然后在第一电极和牺牲层中形成用于形成支撑件的第一开口。 支撑件形成在第一开口中，然后在牺牲层和支撑件上形成第二电极，从而形成微机电系统结构。 之后，使用粘合剂将保护结构粘附并固定到基底上以形成腔室以包围微机电系统结构，并且至少一个第二开口保留在腔室的侧壁上。 随后采用释放蚀刻工艺以通过第二开口去除牺牲层，以便在光学干涉反射结构中形成空腔。 最后，关闭第二个开口以密封衬底和保护结构之间的光学干涉反射结构。

公开(公告)号：US07835061B2

公开(公告)日：2010-11-16

申请号：US11476317

申请日：2006-06-28

申请人： Lior Kogut ,  Ming-Hau Tung ,  Brian Arbuckle

发明人： Lior Kogut ,  Ming-Hau Tung ,  Brian Arbuckle

IPC分类号： G02B26/00

CPC分类号： B81B3/0072 ,  G02B26/001

摘要： A microelectromechanical (MEMS) device includes a functional layer including a first material, a deformable layer including a second material different from the first material, and a connecting element including the first material. The connecting element is mechanically coupled to the deformable layer and the functional layer. The connecting element and the deformable layer form an interface between the first material and the second material. The interface is spaced from the functional layer.

摘要翻译： 微机电（MEMS）装置包括功能层，其包括第一材料，可变形层，其包括不同于第一材料的第二材料，以及包括第一材料的连接元件。 连接元件机械耦合到可变形层和功能层。 连接元件和可变形层在第一材料和第二材料之间形成界面。 界面与功能层间隔开。

公开(公告)号：US20080055707A1

公开(公告)日：2008-03-06

申请号：US11476317

申请日：2006-06-28

申请人： Lior Kogut ,  Ming-Hau Tung ,  Brian Arbuckle

发明人： Lior Kogut ,  Ming-Hau Tung ,  Brian Arbuckle

IPC分类号： G02B26/00

CPC分类号： B81B3/0072 ,  G02B26/001

摘要： A microelectromechanical (MEMS) device includes a functional layer including a first material, a deformable layer including a second material different from the first material, and a connecting element including the first material. The connecting element is mechanically coupled to the deformable layer and the functional layer. The connecting element and the deformable layer form an interface between the first material and the second material. The interface is spaced from the functional layer.

摘要翻译： 微机电（MEMS）装置包括功能层，其包括第一材料，可变形层，其包括不同于第一材料的第二材料，以及包括第一材料的连接元件。 连接元件机械耦合到可变形层和功能层。 连接元件和可变形层在第一材料和第二材料之间形成界面。 界面与功能层间隔开。