发明申请
- 专利标题： System and method for protecting microelectromechanical systems array using structurally reinforced back-plate
- 专利标题（中）： 使用结构加强背板保护微机电系统阵列的系统和方法
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申请号： US11090774申请日： 2005-03-25
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公开(公告)号： US20060076648A1公开(公告)日： 2006-04-13
- 发明人: Brian Gally , Lauren Palmateer , William Cummings
- 申请人： Brian Gally , Lauren Palmateer , William Cummings
- 主分类号： H01L29/06
- IPC分类号： H01L29/06 ; H01L21/46
摘要：
Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on the substrate, and a back-plate. The back-plate is placed over the display array with a gap between the back-plate and the display array. The device further includes reinforcing structures which are integrated with the back-plate. The reinforcing structures add stiffness to the back-plate. The back-plate may have a thickness varying along an edge thereof.
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