发明申请
- 专利标题： Bonding structure, actuator device and liquid-jet head
- 专利标题（中）： 粘结结构，执行机构和喷液头
-
申请号： US11221717申请日： 2005-09-09
-
公开(公告)号： US20060077227A1公开(公告)日： 2006-04-13
- 发明人: Hiroshige Owaki , Yoshinao Miyata
- 申请人： Hiroshige Owaki , Yoshinao Miyata
- 专利权人： SEIKO EPSON CORPORATION
- 当前专利权人： SEIKO EPSON CORPORATION
- 优先权： JP2004-277191 20040924; JP2005-247242 20050829
- 主分类号： B41J2/14
- IPC分类号： B41J2/14
摘要：
A bonding structure comprising bonding wires having a diameter A, bonding pads to which the bonding wires are connected, and bonding portions which, as sites of connection, are arranged on a straight line, and wherein the pitch P of the bonding portions is set at XA+σ or more where 1.80≦X≦2.1, A is as defined above, and σ denotes a variation for the bonding procedure.
公开/授权文献
- US07399061B2 Bonding structure, actuator device and liquid-jet head 公开/授权日：2008-07-15
信息查询
IPC分类:
