摘要:
A liquid injecting head includes a flow path forming substrate in which a pressure generating chamber communicated with a nozzle opening that injects liquid is formed, a pressure generating element that is formed so as to apply pressure to the pressure generating chamber for injecting the liquid, a lead electrode that is connected to the pressure generating element, a wiring substrate having flexibility that is connected to the lead electrode, and a support member that is bonded to the wiring substrate. A fixing opening formed by perforating the wiring substrate in the thickness direction is disposed, and the wiring substrate and the support member are bonded together through an adhesive agent disposed inside the fixing opening.
摘要:
A liquid ejecting head ejects a liquid from pressure generating chambers through nozzles by varying pressure of the pressure generating chambers. The liquid ejecting head includes a nozzle plate in which the nozzles are formed. A first passage forming board is joined to the nozzle plate. A first liquid passage, including the pressure generating chambers, is formed in the first passage forming board. A second passage forming board is joined to the surface of the first liquid passage forming board and has a second liquid passage communicating with the first liquid passage. A first electrode layer electrically connected to the liquid in the first liquid passage and a second, independent, electrode layer are disposed on a vibration plate. Each of the first and second electrode layers includes a terminal drawn to the outside of a junction portion joining the first and second passage forming boards to each other.
摘要:
A bonding structure comprising bonding wires having a diameter A, bonding pads to which the bonding wires are connected, and bonding portions which, as sites of connection, are arranged on a straight line, and wherein the pitch P of the bonding portions is set at XA+σ or more where 1.80≦X≦2.1, A is as defined above, and σ denotes a variation for the bonding procedure.
摘要翻译:一种接合结构,包括具有直径为A的接合线,连接有接合线的接合焊盘以及作为连接点设置在直线上的接合部,并且其中接合部的间距P被设定在 XA + sigma或更大,其中1.80 <= X <= 2.1,A如上所定义,而σ代表粘合过程的变化。
摘要:
There is provided a liquid ejecting head unit that includes a liquid ejecting head ejecting liquid by driving a pressure generating element. The liquid ejecting head unit includes: the liquid ejecting head that includes first wiring substrates each having a connection wiring electrically connected to the pressure generating element and a support member that supports at least two first wiring substrates in different positions; a second wiring substrate that is commonly connected to the connection wirings of a plurality of the first wiring substrates electrically; and a head substrate to which the second wiring substrate is electrically connected. A connection portion connected to the head substrate is aligned on one face side of the second wiring substrate.
摘要:
There is provided a liquid ejecting head unit that includes a liquid ejecting head ejecting liquid by driving a pressure generating element. The liquid ejecting head unit includes: the liquid ejecting head that includes first wiring substrates each having a connection wiring electrically connected to the pressure generating element and a support member that supports at least two first wiring substrates in different positions; a second wiring substrate that is commonly connected to the connection wirings of a plurality of the first wiring substrates electrically; and a head substrate to which the second wiring substrate is electrically connected. A connection portion connected to the head substrate is aligned on one face side of the second wiring substrate.
摘要:
A bonding structure including bonding wires having a diameter A, bonding pads to which the bonding wires are connected, and bonding portions which, as sites of connection, are arranged on a straight line, and wherein the pitch P of the bonding portions is set at XA+σ or more where 1.80≦X≦2.1, A is as defined above, and σ denotes a variation for the bonding procedure.
摘要翻译:包括具有直径A的接合线的接合结构,接合线连接的接合焊盘以及作为连接点设置在直线上的接合部分,并且其中接合部分的间距P被设定在 XA + sigma或更大,其中1.80 <= X <= 2.1,A如上所定义,而σ代表粘合过程的变化。
摘要:
A liquid jet head includes: a passage-forming substrate provided with at least two rows of pressure generating chambers each communicating with a nozzle orifice; and piezoelectric elements for causing pressure change in the pressure generating chambers. The piezoelectric elements are provided on one side of the passage-forming substrate with a vibration plate interposed therebetween. On a joint plate joined to the piezoelectric element side of the passage-forming substrate, driving ICs for driving the piezoelectric elements are provided in regions facing the respective rows of the pressure generating chambers. For each row of the pressure generating chambers, at least one penetrated hole, in which lead electrodes led from the piezoelectric elements are exposed, is provided in a region of the joint plate, the region corresponding to a region between the rows of the pressure generating chambers. A beam portion is formed between the adjacent penetrated holes.
摘要:
A liquid jet head includes: a passage-forming substrate provided with at least two rows of pressure generating chambers each communicating with a nozzle orifice; and piezoelectric elements for causing pressure change in the pressure generating chambers. The piezoelectric elements are provided on one side of the passage-forming substrate with a vibration plate interposed therebetween. On a joint plate joined to the piezoelectric element side of the passage-forming substrate, driving ICs for driving the piezoelectric elements are provided in regions facing the respective rows of the pressure generating chambers. For each row of the pressure generating chambers, at least one penetrated hole, in which lead electrodes led from the piezoelectric elements are exposed, is provided in a region of the joint plate, the region corresponding to a region between the rows of the pressure generating chambers. A beam portion is formed between the adjacent penetrated holes.
摘要:
A discrete element electrode terminal and a driving IC are formed between piezoelectric element rows. A circuit substrate is placed at a side opposite to a flow path substrate side of the driving IC. An input pad is formed on an elastic film at a position corresponding to an inter terminal of the driving IC. An output terminal of the driving IC is electrically bonded to the discrete element electrode terminal, the input terminal of the driving IC is electrically bonded to the input pad, and the input pad is electrically bonded to a substrate terminal of the circuit substrate.
摘要:
The present invention includes a passage-forming substrate on which pressure generating chambers communicating with nozzle orifices ejecting a liquid are respectively formed separately from each other, and actuator devices each including a vibration plate provided on the passage-forming substrate, wherein, a protective plate is jointed to a side of the passage-forming substrate, the side facing the actuator devices, and driver circuits for driving the actuator devices are provided on the protective plate, and wherein each of the driver circuits is provided with individual terminals to which individual electrodes of the respective actuator devices are electrically connected, and connection terminals to which an external wiring line is directly connected, and each of the driver circuits is also provided with a common terminal electrically connected to a common electrode common to more than one of the actuator devices, and with a common connection terminal which is connected to the common terminal through a conductive wiring line and to which an external wiring line is directly connected.