发明申请
US20060081973A1 Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure
有权
集成电路封装，具有由相同引脚到同一焊盘结构形成的电感环路
- 专利标题： Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure
- 专利标题（中）： 集成电路封装，具有由相同引脚到同一焊盘结构形成的电感环路
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申请号： US11274825申请日： 2005-11-16
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公开(公告)号： US20060081973A1公开(公告)日： 2006-04-20
- 发明人: Yido Koo , Hyungki Huh , Kang Lee , Jeong-Woo Lee , Joonbae Park , Kyeongho Lee
- 申请人： Yido Koo , Hyungki Huh , Kang Lee , Jeong-Woo Lee , Joonbae Park , Kyeongho Lee
- 专利权人： GCTS Semiconductor, Inc.
- 当前专利权人： GCTS Semiconductor, Inc.
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
An integrated circuit package includes an inductance loop formed from a connection of bonding wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a bonding pad on the integrated circuit chip to an I/O pin of the package and a second wire which connects the same bonding pad to the same pin. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization.