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    Integrated circuit package having an inductance loop formed from a multi-loop configuration
    3.
    发明申请
    Integrated circuit package having an inductance loop formed from a multi-loop configuration 有权
    具有由多回路配置形成的电感回路的集成电路封装

    公开(公告)号：US20050045986A1

    公开(公告)日：2005-03-03

    申请号：US10927012

    申请日：2004-08-27

    申请人： Yido Koo ,  Hyungki Huh ,  Kang Lee ,  Jeong-Woo Lee ,  Joonbae Park ,  Kyeongho Lee

    发明人： Yido Koo ,  Hyungki Huh ,  Kang Lee ,  Jeong-Woo Lee ,  Joonbae Park ,  Kyeongho Lee

    IPC分类号： H01L20060101 ,  H01L23/64 ,  H01L29/00

    CPC分类号： H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2224/05599

    摘要： An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from first and second wires which connect a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a third and fourth wires which connect a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a third conductor between the pins. The third conductor may include one or more bonding wires and the I/O pins are preferably ones which are adjacent one another. However, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors. In another embodiment, connection between the first and second I/O pins is established by making the I/O pins have a unitary construction. In another embodiment, connection between the first and second I/O pins is established by a metallization layer located either on the surface of the package substrate or within this substrate. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization. Also, the integrated circuit may be implemented in any one of a variety of systems, at least one parameter of which is controlled by the length of the inductor loop of the package.

    摘要翻译： 集成电路封装包括由引线和一个或多个输入/输出（I / O）封装引脚的连接形成的电感回路。 在一个实施例中，电感回路由将集成电路芯片上的第一接合焊盘连接到封装的第一I / O引脚的第一和第二引线形成，以及连接芯片上的第二焊盘的第三和第四引线 到包的第二个I / O引脚。 为了完成电感线圈，第一和第二I / O引脚通过引脚之间的第三根导体连接。 第三导体可以包括一个或多个接合线，并且I / O引脚优选地彼此相邻。 然而，环路可以基于例如环路长度要求，空间考虑和/或其他设计或功能因素的I / O引脚的不相邻连接形成。 在另一个实施例中，通过使I / O引脚具有整体结构来建立第一和第二I / O引脚之间的连接。 在另一个实施例中，第一和第二I / O引脚之间的连接由位于封装基板的表面上或者在该基板内的金属化层建立。 通过在集成电路封装的极限内形成电感器回路，实现了空间要求的显着降低，这反过来促进了小型化。 此外，集成电路可以在各种系统中的任何一个中实现，其中的至少一个参数由封装的电感器环的长度来控制。

    Integrated circuit package having inductance loop formed from a bridge interconnect
    5.
    发明申请
    Integrated circuit package having inductance loop formed from a bridge interconnect 有权
    集成电路封装，其具有由桥互连形成的电感环路

    公开(公告)号：US20050045988A1

    公开(公告)日：2005-03-03

    申请号：US10927152

    申请日：2004-08-27

    申请人： Yido Koo ,  Hyungki Huh ,  Kang Yoon Lee ,  Jeong-Woo Lee ,  Joonbae Park ,  Kyeongho Lee

    发明人： Yido Koo ,  Hyungki Huh ,  Kang Yoon Lee ,  Jeong-Woo Lee ,  Joonbae Park ,  Kyeongho Lee

    IPC分类号： H01L20060101 ,  H01L23/64 ,  H01L29/00 ,  H03B5/12

    CPC分类号： H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H03B5/1215 ,  H03B5/1228 ,  H03B5/1265 ,  H01L2224/45099 ,  H01L2224/05599

    摘要： An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a second wire which connects a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a conductive bridge between the pins. The bridge may be formed by making the I/O pins have a unitary construction. In another embodiment, the bridge is formed by a metallization layer located either on the surface of the package substrate or within this substrate. The I/O pins are preferably ones which are adjacent one another; however, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization. Also, the integrated circuit may be implemented in any one of a variety of systems, at least one parameter of which is controlled by the length of the inductor loop of the package.

    摘要翻译： 集成电路封装包括由引线和一个或多个输入/输出（I / O）封装引脚的连接形成的电感回路。 在一个实施例中，电感回路由将集成电路芯片上的第一接合焊盘连接到封装的第一I / O引脚的第一引线和将芯片上的第二接合焊盘连接到第二引线的第二引线形成 封装的I / O引脚。 为了完成电感环路，第一和第二I / O引脚通过引脚之间的导电桥连接。 可以通过使I / O引脚具有单一结构来形成桥。 在另一个实施例中，桥由位于封装衬底的表面上或在该衬底内的金属化层形成。 I / O引脚优选为彼此相邻的引脚; 然而，环路可以基于例如环路长度要求，空间考虑和/或其他设计或功能因素的I / O引脚的不相邻连接形成。 通过在集成电路封装的极限内形成电感器回路，实现了空间要求的显着降低，这反过来促进了小型化。 此外，集成电路可以在各种系统中的任何一个中实现，其中的至少一个参数由封装的电感器环的长度来控制。

    Integrated circuit package having an inductance loop formed from a multi-loop configuration
    6.
    发明授权
    Integrated circuit package having an inductance loop formed from a multi-loop configuration 有权
    具有由多回路配置形成的电感回路的集成电路封装

    公开(公告)号：US07768097B2

    公开(公告)日：2010-08-03

    申请号：US10927012

    申请日：2004-08-27

    申请人： Yido Koo ,  Hyungki Huh ,  Kang Yoon Lee ,  Jeong-Woo Lee ,  Joonbae Park ,  Kyeongho Lee

    发明人： Yido Koo ,  Hyungki Huh ,  Kang Yoon Lee ,  Jeong-Woo Lee ,  Joonbae Park ,  Kyeongho Lee

    IPC分类号： H01L23/58 ,  H01L29/00 ,  H03B7/06

    CPC分类号： H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2224/05599

    摘要： An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from first and second wires which connect a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a third and fourth wires which connect a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a third conductor between the pins. The third conductor may include one or more bonding wires and the I/O pins are preferably ones which are adjacent one another. However, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors. In another embodiment, connection between the first and second I/O pins is established by making the I/O pins have a unitary construction. In another embodiment, connection between the first and second I/O pins is established by a metallization layer located either on the surface of the package substrate or within this substrate. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization. Also, the integrated circuit may be implemented in any one of a variety of systems, at least one parameter of which is controlled by the length of the inductor loop of the package.

    摘要翻译： 集成电路封装包括由引线和一个或多个输入/输出（I / O）封装引脚的连接形成的电感回路。 在一个实施例中，电感回路由将集成电路芯片上的第一接合焊盘连接到封装的第一I / O引脚的第一和第二引线形成，以及连接芯片上的第二焊盘的第三和第四引线 到包的第二个I / O引脚。 为了完成电感线圈，第一和第二I / O引脚通过引脚之间的第三根导体连接。 第三导体可以包括一个或多个接合线，并且I / O引脚优选地彼此相邻。 然而，环路可以基于例如环路长度要求，空间考虑和/或其他设计或功能因素的I / O引脚的不相邻连接形成。 在另一个实施例中，通过使I / O引脚具有整体结构来建立第一和第二I / O引脚之间的连接。 在另一个实施例中，第一和第二I / O引脚之间的连接由位于封装基板的表面上或者在该基板内的金属化层建立。 通过在集成电路封装的极限内形成电感器回路，实现了空间要求的显着降低，这反过来促进了小型化。 此外，集成电路可以在各种系统中的任何一个中实现，其中的至少一个参数由封装的电感器环的长度来控制。

    System and method for tuning a frequency generator using an LC oscillator
    7.
    发明申请
    System and method for tuning a frequency generator using an LC oscillator 有权

    公开(公告)号：US20060003720A1

    公开(公告)日：2006-01-05

    申请号：US11057414

    申请日：2005-02-15

    申请人： Kang Lee ,  Yido Koo ,  Jeong-Woo Lee ,  Joonbae Park ,  Kyeongho Lee

    发明人： Kang Lee ,  Yido Koo ,  Jeong-Woo Lee ,  Joonbae Park ,  Kyeongho Lee

    IPC分类号： H04B1/40 ,  H04B1/06 ,  H04B7/00

    CPC分类号： H03L7/085 ,  H03L7/099 ,  H03L7/1976 ,  H03L7/199

    摘要： An LC-VCO includes a multivibrator which outputs a frequency signal, a fine tuning circuit which tunes the frequency signal by a first amount, a coarse tuning circuit which tunes the frequency signal by a second amount, and a control circuit which controls the fine and coarse tuning circuits. The coarse tuning circuit is formed from one or more capacitive arrays and the fine tuning circuit is formed from one or more varactors. The capacitive arrays are preferably controlled by a digital signal, where each bit selectively couples a respective capacitor to the multivibrator. An analog signal controls the value of the varactors. The capacitive arrays and varactors charge and discharge an inducator in the multivibrator to tune the frequency signal. The VCO may be incorporated within a phase-locked loop, where the capacitors may be assigned different weight and/or redundancy values to tune an output frequency signal. In one embodiment, coarse tuning and lead-lag detection is performed more accurately to allow the size of the varactors to become significantly reduced compared with other circuits which have been proposed.

    Integrated circuit package having inductance loop formed from a bridge interconnect
    8.
    发明授权
    Integrated circuit package having inductance loop formed from a bridge interconnect 有权
    集成电路封装，其具有由桥互连形成的电感环路

    公开(公告)号：US07071535B2

    公开(公告)日：2006-07-04

    申请号：US10927152

    申请日：2004-08-27

    申请人： Yido Koo ,  Hyungki Huh ,  Kang Yoon Lee ,  Jeong-Woo Lee ,  Joonban Park ,  Kyeongho Lee

    发明人： Yido Koo ,  Hyungki Huh ,  Kang Yoon Lee ,  Jeong-Woo Lee ,  Joonban Park ,  Kyeongho Lee

    IPC分类号： H01L29/00 ,  H03B7/14

    CPC分类号： H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H03B5/1215 ,  H03B5/1228 ,  H03B5/1265 ,  H01L2224/45099 ,  H01L2224/05599

    摘要： An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a second wire which connects a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a conductive bridge between the pins. The bridge may be formed by making the I/O pins have a unitary construction. In another embodiment, the bridge is formed by a metallization layer located either on the surface of the package substrate or within this substrate. The I/O pins are preferably ones which are adjacent one another; however, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization. Also, the integrated circuit may be implemented in any one of a variety of systems, at least one parameter of which is controlled by the length of the inductor loop of the package.

    摘要翻译： 集成电路封装包括由引线和一个或多个输入/输出（I / O）封装引脚的连接形成的电感回路。 在一个实施例中，电感回路由将集成电路芯片上的第一接合焊盘连接到封装的第一I / O引脚的第一引线和将芯片上的第二接合焊盘连接到第二引线的第二引线形成 封装的I / O引脚。 为了完成电感环路，第一和第二I / O引脚通过引脚之间的导电桥连接。 可以通过使I / O引脚具有单一结构来形成桥。 在另一个实施例中，桥由位于封装衬底的表面上或在该衬底内的金属化层形成。 I / O引脚优选为彼此相邻的引脚; 然而，环路可以基于例如环路长度要求，空间考虑和/或其他设计或功能因素的I / O引脚的不相邻连接形成。 通过在集成电路封装的极限内形成电感器回路，实现了空间要求的显着降低，这反过来促进了小型化。 此外，集成电路可以在各种系统中的任何一个中实现，其中的至少一个参数由封装的电感器环的长度来控制。

    Frequency synthesizer using two phase locked loops
    9.
    发明申请
    Frequency synthesizer using two phase locked loops 有权
    频率合成器使用两个锁相环

    公开(公告)号：US20080197891A1

    公开(公告)日：2008-08-21

    申请号：US11902358

    申请日：2007-09-20

    申请人： Joonbae Park ,  Kyeongho Lee ,  Yido Koo ,  Jeong-Woo Lee

    发明人： Joonbae Park ,  Kyeongho Lee ,  Yido Koo ,  Jeong-Woo Lee

    IPC分类号： H03L7/22 ,  H03B21/01

    CPC分类号： H03L7/23 ,  H03L7/183 ,  H03L7/1976

    摘要： The application discloses system and method embodiments related to a frequency synthesizer. Embodiments of a frequency synthesizer can have a low phase noise and a narrow channel spacing. Embodiments of a frequency synthesizer can use two phase locked loops. One embodiment of a frequency synthesizer can include a reference frequency oscillator for outputting a signal having a reference frequency, an integer-N phase locked loop to generate a first output frequency signal based on the reference frequency signal, a fractional-N phase locked loop to generate a second output frequency based on the reference frequency signal and a circuit to generate an output frequency signal by combining the first output frequency and the second output frequency.

    摘要翻译： 本申请公开了与频率合成器相关的系统和方法实施例。 频率合成器的实施例可以具有低相位噪声和窄通道间隔。 频率合成器的实施例可以使用两个锁相环。 频率合成器的一个实施例可以包括：参考频率振荡器，用于输出具有参考频率的信号，整数N个锁相环，以基于参考频率信号产生第一输出频率信号;分数N相锁相环 基于参考频率信号产生第二输出频率，以及通过组合第一输出频率和第二输出频率来产生输出频率信号的电路。

    Frequency synthesizer using two phase locked loops
    10.
    发明授权
    Frequency synthesizer using two phase locked loops 有权
    频率合成器使用两个锁相环

    公开(公告)号：US07560960B2

    公开(公告)日：2009-07-14

    申请号：US11902358

    申请日：2007-09-20

    申请人： Joonbae Park ,  Kyeongho Lee ,  Yido Koo ,  Jeong-Woo Lee

    发明人： Joonbae Park ,  Kyeongho Lee ,  Yido Koo ,  Jeong-Woo Lee

    IPC分类号： H03B21/00

    CPC分类号： H03L7/23 ,  H03L7/183 ,  H03L7/1976

    摘要： The application discloses system and method embodiments related to a frequency synthesizer. Embodiments of a frequency synthesizer can have a low phase noise and a narrow channel spacing. Embodiments of a frequency synthesizer can use two phase locked loops. One embodiment of a frequency synthesizer can include a reference frequency oscillator for outputting a signal having a reference frequency, an integer-N phase locked loop to generate a first output frequency signal based on the reference frequency signal, a fractional-N phase locked loop to generate a second output frequency based on the reference frequency signal and a circuit to generate an output frequency signal by combining the first output frequency and the second output frequency.

    摘要翻译： 本申请公开了与频率合成器相关的系统和方法实施例。 频率合成器的实施例可以具有低相位噪声和窄通道间隔。 频率合成器的实施例可以使用两个锁相环。 频率合成器的一个实施例可以包括：参考频率振荡器，用于输出具有参考频率的信号，整数N个锁相环，以基于参考频率信号产生第一输出频率信号;分数N相锁相环 基于参考频率信号产生第二输出频率，以及通过组合第一输出频率和第二输出频率来产生输出频率信号的电路。