发明申请
US20060083896A1 Semiconductor package with getter formed over an irregular structure
有权
具有吸气剂的半导体封装形成在不规则结构上
- 专利标题： Semiconductor package with getter formed over an irregular structure
- 专利标题（中）： 具有吸气剂的半导体封装形成在不规则结构上
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申请号： US10964331申请日： 2004-10-13
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公开(公告)号： US20060083896A1公开(公告)日： 2006-04-20
- 发明人: James McKinnell , Chien-Hua Chen , Kenneth Diest , Kenneth Kramer , Daniel Kearl
- 申请人： James McKinnell , Chien-Hua Chen , Kenneth Diest , Kenneth Kramer , Daniel Kearl
- 主分类号： G11B5/64
- IPC分类号： G11B5/64
摘要：
A semiconductor package includes a substrate having a first surface portion in a cavity. The first surface portion includes an artificially formed grass structure. The package includes a getter film formed over the grass structure.
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