发明申请
US20060087794A1 Capacitor layer forming material, method of manufacturing a composite foil used where manufacturing the same, and print wiring board having a circuit where a capacitor is embedded, obtained by using the same
审中-公开
电容器层形成材料，制造其中使用的复合箔的制造方法以及具有嵌入电容器的电路的印刷电路板通过使用它们获得
- 专利标题： Capacitor layer forming material, method of manufacturing a composite foil used where manufacturing the same, and print wiring board having a circuit where a capacitor is embedded, obtained by using the same
- 专利标题（中）： 电容器层形成材料，制造其中使用的复合箔的制造方法以及具有嵌入电容器的电路的印刷电路板通过使用它们获得
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申请号： US11259354申请日： 2005-10-27
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公开(公告)号： US20060087794A1公开(公告)日： 2006-04-27
- 发明人: Tomohiro Sakata , Kazuko Taniguchi , Makoto Dobashi
- 申请人： Tomohiro Sakata , Kazuko Taniguchi , Makoto Dobashi
- 申请人地址： JP Tokyo
- 专利权人： Mitsui Mining & Smelting Co., Ltd.
- 当前专利权人： Mitsui Mining & Smelting Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 优先权： JPJP2004-313137 20041027
- 主分类号： H01G4/005
- IPC分类号： H01G4/005
摘要：
It is an object to provide a capacitor layer forming material useful for a printed wiring board with a substrate of fluorine resin, liquid-crystal polymer or the like, which is fabricated by hot-pressing at 300 to 400° C., and showing no deterioration in strength after the hot-pressing. In order to achieve the object, the capacitor layer forming material, comprising a first electroconductive layer used for forming an upper electrode and second electroconductive layer used for forming a lower electrode with a dielectric layer in-between for a printed wiring board, has the second electroconductive layer made of a composite foil comprising a copper layer coated with one or more layers of, plated hard nickel, plated cobalt and plated nickel/cobalt alloy.