发明申请
- 专利标题： Packaging and manufacturing of an integrated circuit
- 专利标题（中）： 集成电路的封装和制造
-
申请号： US10976750申请日： 2004-10-29
-
公开(公告)号： US20060094206A1公开(公告)日： 2006-05-04
- 发明人: Ken Nishimura , Qing Bai , Tracy Verhoeven
- 申请人： Ken Nishimura , Qing Bai , Tracy Verhoeven
- 主分类号： H01L21/30
- IPC分类号： H01L21/30
摘要：
Apparatus, packaging, and methods of manufacture of an integrated circuit are provided. The integrated circuit includes a component of a first type fabricated on a first substrate containing a first material, and a component of a second type fabricated on a second substrate containing a second material. The first material has better compatibility than the second material with fabrication and/or performance of the component of the first type, while the second material has better compatibility than the first material with fabrication and/or performance of the component of the second type. Also described, is a method of making the above-mentioned integrated circuit, the method including, among other steps, the step of disposing the first and second substrates opposite one another, and the step of establishing an electrical connection between the components.
公开/授权文献
- US07274050B2 Packaging and manufacturing of an integrated circuit 公开/授权日：2007-09-25