发明申请
US20060095639A1 Structures and methods for proximity communication using bridge chips 审中-公开
使用桥接芯片的邻近通信的结构和方法

Structures and methods for proximity communication using bridge chips
摘要:
One embodiment of the present invention provides a system that facilitates proximity communication using a bridge chip. This system includes a base chip with an active face, upon which active circuitry and signal pads reside, and a back face opposite the active face. The bridge chip is mounted to the base chip using a mounting, interconnection, and communication structure. The bridge chip is positioned so that a free end is proximate to a neighboring chip, thereby supporting proximity communication between the base chip and the neighboring chip.
信息查询
0/0