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1.发明申请公开(公告)号：US20060095639A1
公开(公告)日：2006-05-04
申请号：US11264956
申请日：2005-11-01
申请人： Bruce Guenin , Arthur Zingher , Ronald Ho , Nyles Nettleton , Ashok Krishnamoorthy , John Cunningham
发明人： Bruce Guenin , Arthur Zingher , Ronald Ho , Nyles Nettleton , Ashok Krishnamoorthy , John Cunningham
IPC分类号： G06F13/36
CPC分类号： H01L23/48 , H01L25/0652 , H01L25/0655 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： One embodiment of the present invention provides a system that facilitates proximity communication using a bridge chip. This system includes a base chip with an active face, upon which active circuitry and signal pads reside, and a back face opposite the active face. The bridge chip is mounted to the base chip using a mounting, interconnection, and communication structure. The bridge chip is positioned so that a free end is proximate to a neighboring chip, thereby supporting proximity communication between the base chip and the neighboring chip.
摘要翻译： 本发明的一个实施例提供一种促进使用桥接芯片的邻近通信的系统。 该系统包括具有主动面的基本芯片，有源电路和信号垫位于该基板上，以及与主动面相对的背面。 桥芯片使用安装，互连和通信结构安装到基座芯片。 桥接芯片被定位成使得自由端靠近相邻的芯片，从而支持基本芯片和相邻芯片之间的邻近通信。
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公开(公告)号：US20070216036A1
公开(公告)日：2007-09-20
申请号：US11385430
申请日：2006-03-20
IPC分类号： H01L23/48
CPC分类号： H01L23/48 , H01L25/0652 , H01L25/50 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： One embodiment of the present invention provides an integrated chip module and a corresponding method of manufacture that facilitates proximity communication. This module includes a base chip and a bridge chip, both of which include an active face, upon which active circuitry and signal pads reside, and a back face opposite the active face. The active face of the bridge chip is bonded to the active face of the base chip, and the back face of the bridge chip is thinned via planarization or polishing.
摘要翻译： 本发明的一个实施例提供了一种便于邻近通信的集成芯片模块和相应的制造方法。 该模块包括基芯片和桥芯片，它们都包括有源电路和信号焊盘所在的有源面以及与有源面相对的背面。 桥芯片的主动面接合到基片的有源面，通过平面化或抛光使桥芯片的背面变薄。
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公开(公告)号：US20070075443A1
公开(公告)日：2007-04-05
申请号：US11515085
申请日：2006-08-31
IPC分类号： H01L23/544
CPC分类号： G02B6/12007 , G02B6/29341 , G02B6/43 , H01L23/48 , H01L24/10 , H01L24/13 , H01L24/72 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/90 , H01L25/0657 , H01L2224/13 , H01L2224/13099 , H01L2224/2919 , H01L2224/81136 , H01L2224/81801 , H01L2224/83136 , H01L2224/83194 , H01L2224/838 , H01L2224/83851 , H01L2225/06527 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/0106 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01075 , H01L2924/01079 , H01L2924/0665 , H01L2924/10157 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： An assembly comprising first and second electronic devices and an optical resonator that optically couples an optical waveguide on the first electronic device to an optical waveguide on the second electronic device. In this way, optical proximity communication between the devices is possible. The electronic devices may be integrated circuit chips. A first portion of an optical resonator is disposed in a pit of the first device to optically couple the optical resonator to the first optical waveguide. A second portion of the optical resonator is disposed in a pit of the second device to optically couple the optical resonator to the second optical waveguide. Thus, the optical resonator optically couples the first optical waveguide to the second optical waveguide.
摘要翻译： 一种包括第一和第二电子器件的组件和将第一电子器件上的光波导光耦合到第二电子器件上的光波导的光学谐振器。 以这种方式，设备之间的光学邻近通信是可能的。 电子设备可以是集成电路芯片。 光谐振器的第一部分设置在第一器件的凹坑中，以将光谐振器光学耦合到第一光波导。 光谐振器的第二部分设置在第二器件的凹坑中以将光谐振器光学耦合到第二光波导。 因此，光学谐振器将第一光波导光学耦合到第二光波导。
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4.发明申请Method and apparatus for facilitating proximity communication and power delivery 有权用于促进邻近通信和电力传递的方法和装置公开(公告)号：US20070075442A1
公开(公告)日：2007-04-05
申请号：US11385445
申请日：2006-03-20
IPC分类号： H01L23/544
CPC分类号： H01L23/48 , G02B6/12007 , G02B6/29341 , G02B6/43 , H01L24/10 , H01L24/13 , H01L24/72 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/90 , H01L25/0657 , H01L2224/05556 , H01L2224/05572 , H01L2224/05573 , H01L2224/056 , H01L2224/10135 , H01L2224/10165 , H01L2224/13 , H01L2224/13099 , H01L2224/1319 , H01L2224/2919 , H01L2224/81138 , H01L2224/81141 , H01L2224/81801 , H01L2224/83141 , H01L2224/83194 , H01L2224/838 , H01L2224/83851 , H01L2225/06527 , H01L2924/01006 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/10157 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： One embodiment of the present invention provides a system that facilitates precise inter-chip alignment for proximity communication and power delivery. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit chip, whose surface has corresponding etch pit wells configured to align with the etch pit wells of the first integrated circuit chip. A shaped structure is placed in an etch pit well of the first integrated circuit chip such that when the corresponding etch pit well of the second integrated circuit chip is substantially aligned with the etch pit well of the first integrated circuit chip, the shaped structure mates with both the etch pit well of the first integrated circuit chip and with the corresponding etch pit well of the second integrated circuit chip, thereby precisely aligning the first integrated circuit chip with the second integrated circuit chip. Besides aiding in alignment, the shaped structure also creates a conductive connection between the first integrated circuit chip and the second integrated circuit chip.
摘要翻译： 本发明的一个实施例提供了一种便于精确的芯片间对准以进行邻近通信和功率输送的系统。 该系统包括第一集成电路芯片，其表面具有蚀刻凹坑。 该系统还包括第二集成电路芯片，其表面具有配置为与第一集成电路芯片的蚀刻凹坑对准的相应蚀刻凹坑。 成形结构放置在第一集成电路芯片的蚀刻凹坑中，使得当第二集成电路芯片的相应蚀刻凹坑与第一集成电路芯片的蚀刻凹坑基本对准时，成形结构与 第一集成电路芯片的蚀刻凹坑以及第二集成电路芯片的相应蚀刻凹坑两者，从而将第一集成电路芯片与第二集成电路芯片精确对准。 除了辅助对准之外，成形结构还在第一集成电路芯片和第二集成电路芯片之间形成导电连接。
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5.发明授权
公开(公告)号：US6005262A
公开(公告)日：1999-12-21
申请号：US14196
申请日：1998-01-27
CPC分类号： H01S5/02248 , H01L2224/16225 , H01S5/0224 , H01S5/02272 , H01S5/183
摘要： A flip-chip bonded VCSEL CMOS circuit for preventing rearwardly emitted photons from the VCSEL from interfering with CMOS operation. The CMOS has bonding pads affixed thereto and spaced apart to define a region. The VCSEL is mounted to the bonding pads so that a lower mirror of the VCSEL is positioned between the bonding pads and in close proximity to an upper, major surface of the CMOS. A blocking layer is provided and is positioned within the region defined by the bonding pads to absorb or reflect rearwardly emitted photons from the VCSEL. In another embodiment, the blocking layer is removed and a photon detector is formed in the CMOS for collecting the rearwardly emitted photons for use in determining, inter alia, VCSEL laser power.
摘要翻译： 用于防止来自VCSEL的向后发射的光子的倒装芯片连接的VCSEL CMOS电路干扰CMOS操作。 CMOS具有固定到其上并且间隔开以限定区域的键合垫。 VCSEL被安装到接合焊盘，使得VCSEL的下反射镜位于接合焊盘之间并且紧邻CMOS的上部主表面。 提供阻挡层并且位于由接合焊盘限定的区域内以从VCSEL吸收或反射向后发射的光子。 在另一个实施例中，去除阻挡层，并且在CMOS中形成光子检测器以收集向后发射的光子，以用于确定VCSEL激光功率。
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公开(公告)号：US20080018000A1
公开(公告)日：2008-01-24
申请号：US11243300
申请日：2005-10-03
IPC分类号： H01L23/544
CPC分类号： H01L25/0657 , H01L23/48 , H01L24/72 , H01L24/90 , H01L2224/13 , H01L2224/2919 , H01L2224/81136 , H01L2224/81138 , H01L2224/81141 , H01L2224/81801 , H01L2224/83136 , H01L2224/83194 , H01L2224/838 , H01L2224/83851 , H01L2225/06527 , H01L2225/06531 , H01L2225/06593 , H01L2924/01027 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/0665 , H01L2924/10157 , H01L2924/10253 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： A system that facilitates precise inter-chip alignment. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit chip, whose surface has corresponding etch pit wells that mate with the etch pit wells of the first integrated circuit chip. Spherical balls are placed in the etch pit wells of the first integrated circuit chip such that when the corresponding etch pit wells of the second integrated circuit chip are substantially aligned with the spherical balls, the spherical balls mate with the etch well pits of the second integrated circuit chip, thereby precisely aligning the first integrated circuit chip with the second integrated circuit chip.
摘要翻译： 一种便于精确的芯片间对准的系统。 该系统包括第一集成电路芯片，其表面具有蚀刻凹坑。 该系统还包括第二集成电路芯片，其表面具有与第一集成电路芯片的蚀刻凹坑相配合的相应蚀刻凹坑。 球形球被放置在第一集成电路芯片的蚀刻凹坑中，使得当第二集成电路芯片的相应蚀刻凹坑基本上与球形球对准时，球形球与第二集成电路芯片的蚀刻井凹坑配合 从而将第一集成电路芯片与第二集成电路芯片精确对准。
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公开(公告)号：US20070075444A1
公开(公告)日：2007-04-05
申请号：US11515207
申请日：2006-08-31
IPC分类号： H01L23/544
CPC分类号： G02B6/12007 , G02B6/29341 , G02B6/43 , H01L23/48 , H01L24/10 , H01L24/13 , H01L24/72 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/90 , H01L25/0657 , H01L2224/13 , H01L2224/13099 , H01L2224/2919 , H01L2224/81136 , H01L2224/81801 , H01L2224/83136 , H01L2224/83194 , H01L2224/838 , H01L2224/83851 , H01L2225/06527 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/0106 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/10157 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： An assembly comprising first and second electronic devices and an optical coupling device that optically couples an optical waveguide on the first electronic device to an optical waveguide on the second electronic device. In this way, optical proximity communication between the devices is possible. The electronic devices may be integrated circuit chips. The first optical waveguide is positioned relative to the optical coupling device to direct an optical signal to the optical coupling device. Further, the second optical waveguide is positioned relative to the optical coupling device to receive the optical signal, which is directed from the optical coupling device to the second optical waveguide. Thus, the optical coupling device optically couples the first optical waveguide to the second optical waveguide.
摘要翻译： 一种组件，包括第一和第二电子设备以及将第一电子设备上的光波导光耦合到第二电子设备上的光波导的光耦合设备。 以这种方式，设备之间的光学邻近通信是可能的。 电子设备可以是集成电路芯片。 第一光波导相对于光耦合装置定位，以将光信号引导到光耦合装置。 此外，第二光波导相对于光耦合装置定位，以接收从光耦合装置指向第二光波导的光信号。 因此，光耦合装置将第一光波导光学耦合到第二光波导。
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公开(公告)号：USD776529S1
公开(公告)日：2017-01-17
申请号：US29515743
申请日：2015-01-26
申请人： Miriam Torrison , John Cunningham , Scott DeJong
设计人： Miriam Torrison , John Cunningham , Scott DeJong
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公开(公告)号：US09347793B2
公开(公告)日：2016-05-24
申请号：US13437470
申请日：2012-04-02
申请人： John Meeker , John Cunningham , David Baughman
发明人： John Meeker , John Cunningham , David Baughman
CPC分类号： G01C23/00 , G01C21/3638 , G01S7/20 , G01S13/94 , G01S17/933 , G06T15/00 , G06T15/08 , G06T17/00 , G06T17/05 , G06T19/00
摘要： A display system is provided for a vehicle. The display system includes a data source configured to provide terrain data with detached objects that are detached from ground terrain and attached objects that are attached to ground terrain; a processing unit coupled to the data source configured to receive the terrain data and to distinguish the detached objects from the attached objects to generate display commands for a three-dimensional view that comprises graphical elements representing both the detached objects and the attached objects; and a display device coupled to the processing unit and configured to receive the display commands and operable to render the common three-dimensional view to thereby allow viewing of the detached objects and the attached objects.
摘要翻译： 为车辆提供显示系统。 显示系统包括数据源，其被配置为向地形数据提供与地面分离的分离物体和附着到地面的附着物体; 耦合到数据源的处理单元，被配置为接收地形数据并且将分离的对象与所附接的对象区分开来，以生成包括表示分离的对象和附接对象的图形元素的三维视图的显示命令; 以及显示设备，其耦合到所述处理单元并且被配置为接收所述显示命令并且可操作以呈现所述共同的三维视图，从而允许观看所述分离的对象和所附接的对象。
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公开(公告)号：USD751381S1
公开(公告)日：2016-03-15
申请号：US29515734
申请日：2015-01-26
申请人： Miriam Torrison , John Cunningham , Scott DeJong
设计人： Miriam Torrison , John Cunningham , Scott DeJong
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