发明申请
- 专利标题： Stepped integrated circuit packaging and mounting
- 专利标题（中）： 步进式集成电路封装和安装
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申请号： US10970410申请日： 2004-10-21
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公开(公告)号： US20060097370A1公开(公告)日： 2006-05-11
- 发明人: Gerald Bartley , Richard Ericson , Wesley Martin , Benjamin Mashak , Trevor Timpane , Ay Vang
- 申请人： Gerald Bartley , Richard Ericson , Wesley Martin , Benjamin Mashak , Trevor Timpane , Ay Vang
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
An electronic assembly and system and method implementing the same are disclosed herein. The electronic assembly includes an IC carrier package having circuitry contained within a housing unit. The IC carrier package includes a connector interface for electrically coupling the IC carrier package circuitry to a printed circuit board. The connector interface is further characterized as having a graduated step surface contour with one or more electrical contacts disposed on at least two graduated step connector surfaces of the connector interface. The electronic assembly further includes a multilayer printed circuit board having a mounting site cavity for mounting the IC carrier package. The mounting site cavity includes having at least two seating surfaces offset in a graduated step manner for receivably seating the at least two graduated step connector surfaces of the IC carrier package connector interface.
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IPC分类:
