发明申请
- 专利标题： CONTACT FOR DUAL LINER PRODUCT
- 专利标题（中）： 联系双线产品
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申请号： US10904059申请日： 2004-10-21
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公开(公告)号： US20060099793A1公开(公告)日： 2006-05-11
- 发明人: Haining Yang , Clement Wann , Huilong Zhu
- 申请人： Haining Yang , Clement Wann , Huilong Zhu
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763
摘要：
A structure is provided which includes a semiconductor device region including a first portion and a second portion. A current-conducting member is provided, which extends horizontally over the first portion but not over the second portion. A first film, such as a stress-imparting film, extends over the second portion and only partially over the current-conducting member to expose a contact portion of the member. A first contact via is provided in conductive communication with the contact portion of the member, the first contact via having a self-aligned silicide-containing region. A second contact via is provided in conductive communication with the second portion of the semiconductor device region, the second contact via extending through the first film.
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