发明申请
- 专利标题： Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
- 专利标题（中）： 电路连接材料，使用其的薄膜状电路连接材料，电路部件连接结构及其制造方法
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申请号： US10541380申请日： 2004-06-24
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公开(公告)号： US20060100314A1公开(公告)日： 2006-05-11
- 发明人: Motohiro Arifuku , Itsuo Watanabe , Yasushi Gotou , Kouji Kobayashi , Kazuyoshi Kojima
- 申请人： Motohiro Arifuku , Itsuo Watanabe , Yasushi Gotou , Kouji Kobayashi , Kazuyoshi Kojima
- 优先权： JP2003-181593 20030625
- 国际申请： PCT/JP04/08896 WO 20040624
- 主分类号： C08K9/12
- IPC分类号： C08K9/12
摘要：
The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.