公开(公告)号：US20110247757A1

公开(公告)日：2011-10-13

申请号：US13163442

申请日：2011-06-17

申请人： Motohiro ARIFUKU ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

发明人： Motohiro ARIFUKU ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

IPC分类号： H05K13/04 ,  B32B37/06 ,  B32B37/12 ,  B32B37/14 ,  B32B37/02 ,  B32B37/10 ,  B82Y99/00 ,  B82Y30/00

CPC分类号： H01L24/83 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/3452 ,  H05K2203/0594 ,  Y10T156/10 ,  Y10T428/2495 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05552

摘要： The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

摘要翻译： 本发明是一种电路连接材料，用于将电路和绝缘层彼此相邻形成的电路部件的相互连接在基板的表面上，以及电路部件，其中电极和绝缘层邻近形成 彼此在板的表面上，边缘部分和绝缘层基于主表面形成比电极更大的厚度，其中该电路连接材料包含粘合剂组合物和具有 平均粒径为1μm以上且小于10μm，硬度为1.961〜6.865GPa，该电路连接材料在40℃下的储能弹性模量为0.5〜3GPa，平均热膨胀系数 当进行固化处理时，在25℃至100℃下为30-200ppm /℃。

公开(公告)号：US20060260744A1

公开(公告)日：2006-11-23

申请号：US11494709

申请日：2006-07-28

申请人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

发明人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： C09J5/00

CPC分类号： H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.

公开(公告)号：US08202622B2

公开(公告)日：2012-06-19

申请号：US12557076

申请日：2009-09-10

申请人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

发明人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

IPC分类号： H01R11/01 ,  H01B1/22 ,  H01L21/60 ,  H05K1/14 ,  H05K3/36 ,  C09J9/02

CPC分类号： H01L24/83 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/3452 ,  H05K2203/0594 ,  Y10T156/10 ,  Y10T428/2495 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05552

摘要： The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

摘要翻译： 本发明是一种电路连接材料，用于将电路和绝缘层彼此相邻形成的电路部件的相互连接在基板的表面上，以及电路部件，其中电极和绝缘层邻近形成 彼此在板的表面上，边缘部分和绝缘层基于主表面形成比电极更大的厚度，其中该电路连接材料包含粘合剂组合物和具有 平均粒径为1μm以上且小于10μm，硬度为1.961〜6.865GPa，该电路连接材料在40℃下的储能弹性模量为0.5〜3GPa，平均热膨胀系数 当进行固化处理时，在25℃至100℃下为30-200ppm /℃。

公开(公告)号：US20090321116A1

公开(公告)日：2009-12-31

申请号：US12557076

申请日：2009-09-10

申请人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

发明人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

IPC分类号： H05K1/09 ,  H05K1/11 ,  H05K1/03

CPC分类号： H01L24/83 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/3452 ,  H05K2203/0594 ,  Y10T156/10 ,  Y10T428/2495 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05552

摘要： The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

摘要翻译： 本发明是一种电路连接材料，用于将电路和绝缘层彼此相邻形成的电路部件的相互连接在基板的表面上，以及电路部件，其中电极和绝缘层邻近形成 彼此在板的表面上，边缘部分和绝缘层基于主表面形成比电极更大的厚度，其中该电路连接材料包含粘合剂组合物和具有 平均粒径为1μm以上且小于10μm，硬度为1.961〜6.865GPa，该电路连接材料在40℃下的储能弹性模量为0.5〜3GPa，平均热膨胀系数 当进行固化处理时，在25℃至100℃下为30-200ppm /℃。

公开(公告)号：US20060263599A1

公开(公告)日：2006-11-23

申请号：US11494708

申请日：2006-07-28

申请人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

发明人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： B32B7/12

CPC分类号： H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.

摘要翻译： 本发明涉及一种连接电极的方法，包括：插入由式（I）表示的多苯酞：其中R表示二价芳族烃基或含二价杂环的芳族基团，R 1表示 烷基，氟化烷基，烷氧基或卤原子，其中R 1的数目为0至4，X表示O或NR 3，提供 R 3表示以下基团之一，Y表示SO 2或Co，n表示聚合物中的重复单元数，作为压敏导电性聚合物 最少部分地彼此相对的电极; 并且施加压力以固定两个电极，包括形成在电极部分的至少一部分表面上的由式（I）表示的多苯酞的表面处理布线板，包含由式（I）表示的粘合剂和多苯酞的粘合剂膜 （I），以及使用其的电极连接结构。

公开(公告)号：US20060100314A1

公开(公告)日：2006-05-11

申请号：US10541380

申请日：2004-06-24

申请人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

发明人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

IPC分类号： C08K9/12

CPC分类号： H01L24/83 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/3452 ,  H05K2203/0594 ,  Y10T156/10 ,  Y10T428/2495 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05552

摘要： The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

摘要翻译： 本发明是一种电路连接材料，用于将电路和绝缘层彼此相邻形成的电路部件的相互连接在基板的表面上，以及电路部件，其中电极和绝缘层邻近形成 彼此在板的表面上，边缘部分和绝缘层基于主表面形成比电极更大的厚度，其中该电路连接材料包含粘合剂组合物和具有 平均粒径为1μm以上且小于10μm，硬度为1.961〜6.865GPa，该电路连接材料在40℃下的储能弹性模量为0.5〜3GPa，平均热膨胀系数 当进行固化处理时，在25℃至100℃下为30-200ppm /℃。

公开(公告)号：US20110247870A1

公开(公告)日：2011-10-13

申请号：US13163382

申请日：2011-06-17

申请人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

发明人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

IPC分类号： H05K1/11 ,  H01B1/00 ,  H01B1/22

CPC分类号： H01L24/83 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/3452 ,  H05K2203/0594 ,  Y10T156/10 ,  Y10T428/2495 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05552

摘要： The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

摘要翻译： 本发明是一种电路连接材料，用于将电路和绝缘层彼此相邻形成的电路部件的相互连接在基板的表面上，以及电路部件，其中电极和绝缘层邻近形成 彼此在板的表面上，边缘部分和绝缘层基于主表面形成比电极更大的厚度，其中该电路连接材料包含粘合剂组合物和具有 平均粒径为1μm以上且小于10μm，硬度为1.961〜6.865GPa，该电路连接材料在40℃下的储能弹性模量为0.5〜3GPa，平均热膨胀系数 当进行固化处理时，在25℃至100℃下为30-200ppm /℃。

公开(公告)号：US20100025089A1

公开(公告)日：2010-02-04

申请号：US10585461

申请日：2005-01-01

申请人： Jun Taketatsu ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kazuo Yamaguchi ,  Masaki Fujii ,  Aya Fujii

发明人： Jun Taketatsu ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kazuo Yamaguchi ,  Masaki Fujii ,  Aya Fujii

IPC分类号： H05K1/09 ,  H01R43/00

CPC分类号： H01R4/04 ,  H01R12/52 ,  H01R43/007 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0224 ,  Y10T29/49117

摘要： A circuit member connection structure 10 according to the invention is provided with circuit members 20,30 having a plurality of circuit electrodes 22,32 formed on the main surfaces 21a,31a of circuit boards 21,31. A circuit connecting member 60 which connects together the circuit members 20,30 with the circuit electrodes 22,32 opposing each other is comprising a cured circuit connecting material of the invention. The circuit connecting material of the invention comprises an adhesive composition and covered particles 50 comprising conductive particles 51 with portions of their surfaces 51a covered by insulating fine particles 52, wherein the mass of the insulating fine particles 52 constitutes 2/1000 to 26/1000 of the mass of the conductive particles 51.

摘要翻译： 根据本发明的电路构件连接结构10设置有电路构件20,30，其具有形成在电路板21,31的主表面21a，31a上的多个电路电极22,32。 将电路构件20,30与电路电极22,32相互连接在一起的电路连接构件60包括本发明的固化电路连接材料。 本发明的电路连接材料包括粘合剂组合物和覆盖的颗粒50，其包括导电颗粒51，其表面51a的部分被绝缘细颗粒52覆盖，其中绝缘细颗粒52的质量构成2/1000至26/1000的 导电粒子51的质量。

公开(公告)号：US08043709B2

公开(公告)日：2011-10-25

申请号：US10541380

申请日：2004-06-24

申请人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

发明人： Motohiro Arifuku ,  Itsuo Watanabe ,  Yasushi Gotou ,  Kouji Kobayashi ,  Kazuyoshi Kojima

IPC分类号： H01R11/01 ,  H01B1/22 ,  H01L21/60 ,  H05K1/14 ,  H05K3/36 ,  C09J9/02

CPC分类号： H01L24/83 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/3452 ,  H05K2203/0594 ,  Y10T156/10 ,  Y10T428/2495 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2224/2919 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05552

摘要： The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

摘要翻译： 本发明是一种电路连接材料，用于将电路和绝缘层彼此相邻形成的电路部件的相互连接在基板的表面上，以及电路部件，其中电极和绝缘层邻近形成 彼此在板的表面上，边缘部分和绝缘层基于主表面形成比电极更大的厚度，其中该电路连接材料包含粘合剂组合物和具有 平均粒径为1μm以上且小于10μm，硬度为1.961〜6.865GPa，该电路连接材料在40℃下的储能弹性模量为0.5〜3GPa，平均热膨胀系数 当进行固化处理时，在25℃至100℃下为30-200ppm /℃。

公开(公告)号：US07771559B2

公开(公告)日：2010-08-10

申请号：US11494709

申请日：2006-07-28

申请人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

发明人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： C09J5/00

CPC分类号： H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.

摘要翻译： 本发明涉及一种电极连接方法，其特征在于，包括：插入由式（I）表示的多苯酞：其中R表示二价芳族烃基或含二价杂芳基的芳族基团，R 1表示烷基，氟化烷基 R 1为0〜4的烷氧基或卤素原子，X表示O或N-R 3，条件是R 3表示以下基团之中，Y表示SO 2或Co，n表示重复单元数 在聚合物中，作为至少部分地彼此相对的电极之间的压敏导电聚合物; 并且施加压力以固定两个电极，包括形成在电极部分的至少一部分表面上的由式（I）表示的多苯酞的表面处理的布线板，包含由式（I）表示的粘合剂和多苯酞的粘合剂膜 （I），以及使用其的电极连接结构。