发明申请
- 专利标题： Solder ball formation and transfer method
- 专利标题（中）： 焊球形成和转移方法
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申请号： US10993962申请日： 2004-11-19
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公开(公告)号： US20060108402A1公开(公告)日： 2006-05-25
- 发明人: Richard Crisp , Giles Humpston
- 申请人： Richard Crisp , Giles Humpston
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 主分类号： B23K31/02
- IPC分类号： B23K31/02
摘要：
A method of forming and applying a solder mass comprised of depositing solder paste containing a carrier and a solder onto a first substrate, not wettable by said solder; reflowing the solder paste on the first substrate to cause the solder to coalesce into a solder mass; and transferring the solder mass from the first substrate to a second substrate.