- 专利标题： Printed wiring board and a method of manufacturing the same
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申请号： US11293337申请日： 2005-12-01
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公开(公告)号： US20060113108A1公开(公告)日： 2006-06-01
- 发明人: Kunihiro Tan
- 申请人： Kunihiro Tan
- 优先权： JPJP2004-349199 20041201
- 主分类号： H05K1/16
- IPC分类号： H05K1/16
摘要：
This patent specification describes a printed wiring board which includes an insulating board, a wiring pattern, and a resistor pattern. The wiring pattern includes a metallic material and is formed on the insulating board in a process step. The resistor pattern includes the metallic material and is formed on the insulating board at a time together with the wiring pattern in the process step of the wiring pattern.
公开/授权文献
- US07535724B2 Printed wiring board and a method of manufacturing the same 公开/授权日：2009-05-19
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