公开(公告)号：US20140079458A1

公开(公告)日：2014-03-20

申请号：US13974281

申请日：2013-08-23

申请人： Masami SETO ,  Kunihiro Tan ,  Shinichi Kubota ,  Yoshihiko Miki

发明人： Masami SETO ,  Kunihiro Tan ,  Shinichi Kubota ,  Yoshihiko Miki

IPC分类号： G03G15/00 ,  G01N19/10

CPC分类号： G03G21/203 ,  G01N19/10 ,  G03G15/55

摘要： A sheet material identification device includes a humidity adjuster, a detector, and a controller. The humidity adjuster adjusts the humidity of a sheet material by causing the sheet material to either release or absorb moisture. The detector detects the humidity of the sheet material before and after the adjustment of the humidity. The controller calculates a first difference in humidity of the sheet material before and after the adjustment of the humidity, and identifies the type of sheet material on the basis of the first difference.

摘要翻译： 片材识别装置包括湿度调节器，检测器和控制器。 湿度调节器通过使片材材料释放或吸收水分来调节片材的湿度。 检测器在调节湿度之前和之后检测片材的湿度。 控制器计算在调节湿度之前和之后的片材的湿度的第一差异，并且基于第一差异来识别片材的类型。

公开(公告)号：US20090201029A1

公开(公告)日：2009-08-13

申请号：US11663605

申请日：2006-07-13

申请人： Isao Asano ,  Kunihiro Tan

发明人： Isao Asano ,  Kunihiro Tan

IPC分类号： H01H31/02

CPC分类号： G01R31/2884 ,  H01L2224/16225

摘要： An electronic component device testing apparatus includes first contacts arrayed so that first ends of the first contacts positionally correspond to electrode pads arrayed on a surface of an electronic component device; base electrodes in contact with second ends of the first contacts; and one or more second contacts each being in contact with one of the first contacts at a position which is between the first end and the second end of the one of the first contacts and closer to the first end of the one of the first contacts.

摘要翻译： 一种电子部件装置测试装置，包括：第一触点排列成使得第一触头的第一端部位于电子部件装置的表面上排列的电极焊盘; 基极与第一触点的第二端接触; 以及一个或多个第二触点，每个第二触点在位于第一触点之一的第一端和第二端之间并且更靠近第一触点之一的第一端的位置处与第一触点中的一个接触。

公开(公告)号：US20090084589A1

公开(公告)日：2009-04-02

申请号：US12293192

申请日：2007-01-17

申请人： Kunihiro Tan

发明人： Kunihiro Tan

IPC分类号： H05K1/11 ,  B23K31/02 ,  H05K1/09 ,  B23K1/20

CPC分类号： H05K3/328 ,  H01R43/0256 ,  H05K1/113 ,  H05K3/244 ,  H05K2201/1028 ,  H05K2201/1034

摘要： A lead terminal bonding method includes the steps of forming a land part on a front surface of a base substrate, the land part including a metal foil; forming a metal plating layer on a surface of the land part, the metal plating layer having a Young's modulus greater than that of the metal foil; and directly bonding a metal plate to the metal plating layer by spot-welding.

摘要翻译： 引线端子接合方法包括以下步骤：在基底基板的前表面上形成焊盘部分，所述焊盘部分包括金属箔; 在所述焊盘部的表面上形成金属镀层，所述金属镀层的杨氏模量大于所述金属箔的杨氏模量; 并通过点焊将金属板直接接合到金属镀层上。

公开(公告)号：US07426118B2

公开(公告)日：2008-09-16

申请号：US11127755

申请日：2005-05-11

申请人： Kunihiro Tan

发明人： Kunihiro Tan

IPC分类号： H05K9/00

CPC分类号： H05K1/0228 ,  H05K1/165 ,  H05K1/167 ,  H05K2201/09263

摘要： To cancel a magnetic field in an interconnection pattern of a printed wiring board.A first interconnection pattern 3a is formed on a surface 1a of an insulating substrate 1. A second interconnection pattern 5a is formed on a bottom surface 1b of the insulating substrate 1 so as to be superposed on a meandering part of the first interconnection pattern 3a when viewed from the upper surface side. An end part 5b of the second interconnection pattern 5a is electrically connected to an end part 3d of the first interconnection pattern 3a via through holes 7a. The first interconnection pattern 3a and the second interconnection pattern 5a form a single interconnection line via the through holes 7a. Accordingly, the first interconnection pattern 3a and the second interconnection pattern 5a are 180° different from each other in the direction in which current flows.

摘要翻译： 消除印刷电路板的互连图形中的磁场。 第一互连图形3a形成在绝缘基板1的表面1a上。 第二互连图案5a形成在绝缘基板1的底面1b上，以便从上表面侧观察时叠置在第一互连图案3a的曲折部分上。 第二互连图案5a的端部5b与第一互连图案3a的通孔7a电连接。 第一互连图案3a和第二互连图案5a通过通孔7a形成单个互连线。 因此，第一互连图案3a和第二互连图案5a在电流流动的方向上彼此相差180°。

公开(公告)号：US20060289199A1

公开(公告)日：2006-12-28

申请号：US11127755

申请日：2005-05-11

申请人： Kunihiro Tan

发明人： Kunihiro Tan

IPC分类号： H05K1/11

CPC分类号： H05K1/0228 ,  H05K1/165 ,  H05K1/167 ,  H05K2201/09263

摘要： To cancel a magnetic field in an interconnection pattern of a printed wiring board. A first interconnection pattern 3a is formed on a surface 1a of an insulating substrate 1. A second interconnection pattern 5a is formed on a bottom surface 1b of the insulating substrate 1 so as to be superposed on a meandering part of the first interconnection pattern 3a when viewed from the upper surface side. An end part 5b of the second interconnection pattern 5a is electrically connected to an end part 3d of the first interconnection pattern 3a via through holes 7a. The first interconnection pattern 3a and the second interconnection pattern 5a form a single interconnection line via the through holes 7a. Accordingly, the first interconnection pattern 3a and the second interconnection pattern 5a are 180° different from each other in the direction in which current flows. the second interconnection pattern are sandwiched between insulating materials so that no metal plating is provided on the first interconnection pattern and the second interconnection pattern. The printed wiring board as claimed in any of claims 6 to 9, wherein the first interconnection pattern and the second interconnection pattern are formed meanderingly.

摘要翻译： 消除印刷电路板的互连图形中的磁场。 第一互连图案3a形成在绝缘基板1的表面1a上。第二互连图案5a形成在绝缘基板1的底面1b上，以便叠置在第一互连件的曲折部分上 图案3a从上表面侧观察。 第二互连图案5a的端部5b与第一互连图案3a的通孔7a电连接。 第一互连图案3a和第二互连图案5a通过通孔7a形成单个互连线。 因此，第一互连图案3a和第二互连图案5a在电流流动的方向上彼此相差180°。 第二互连图形被夹在绝缘材料之间，使得在第一互连图案和第二互连图案上不设置金属电镀。 10.根据权利要求6至9中任一项所述的印刷电路板，其特征在于，所述第一互连图案和所述第二互连图案曲折地形成。

公开(公告)号：US07781089B2

公开(公告)日：2010-08-24

申请号：US11127754

申请日：2005-05-11

申请人： Kunihiro Tan ,  Masahiro Higashiguchi ,  Seiichi Morishita ,  Yukiyoshi Mitsuke

发明人： Kunihiro Tan ,  Masahiro Higashiguchi ,  Seiichi Morishita ,  Yukiyoshi Mitsuke

IPC分类号： H01M2/34

CPC分类号： H01M2/34 ,  H01M10/425 ,  H05K1/181

摘要： To realize reduction in the size and cost of a protection circuit module for a secondary battery.A protection circuit module 1 for a secondary battery has at least a wiring board 2 having multiple battery-side external terminals 4a and multiple load-side external terminals 20a, and semiconductor components 12 and 14 mounted on the wiring board 2. On the wiring board 2, the battery-side external terminals 4a are disposed on a surface 2a, and the load-side external terminals 20a are disposed on a surface 2b on the opposite side. The semiconductor components 12 and 14 have multiple external connection terminals 12a and 14a arranged on a single plane surface, and are mounted face-down in a bare-chip state on the surface 2a of the wiring board 2.

摘要翻译： 为了实现二次电池的保护电路模块的尺寸和成本的降低。 用于二次电池的保护电路模块1至少具有多个电池侧外部端子4a和多个负载侧外部端子20a以及安装在布线板2上的半导体部件12和14的布线板2.在布线板 如图2所示，电池侧外部端子4a配置在表面2a上，负载侧外部端子20a配置在相对侧的面2b上。 半导体组件12和14具有布置在单个平面上的多个外部连接端子12a和14a，并且以裸芯片状态安装在布线板2的表面2a上。

公开(公告)号：US20190204273A1

公开(公告)日：2019-07-04

申请号：US15929053

申请日：2018-10-18

申请人： Katsuya UJIMOTO ,  Shinichi KUBOTA ,  Kunihiro TAN

发明人： Katsuya UJIMOTO ,  Shinichi KUBOTA ,  Kunihiro TAN

IPC分类号： G01N27/62 ,  H01J49/10 ,  H01J49/00

CPC分类号： G01N27/624 ,  H01J49/0027 ,  H01J49/10

摘要： An ion sensor, an ion sensor manufacturing method, and a field asymmetric ion mobility spectrometry (FAIMS) system. The ion sensor includes an ion filter including a first electrode and a second electrode facing each other, an ion sensing electrode with which an ion that has passed through the ion filter collides, and an insulator to electrically insulate the ion sensing electrode from the first electrode and the second electrode. The method includes forming a first slit on an active layer of an at least one SOI substrate, the at least one SOI substrate including a base layer, an insulating layer on the base layer, and the active layer on the insulating layer, dividing the active layer into two, forming a second slit through the base layer, the second slit overlapping with the first slit in a planar view, and forming a third slit through the insulating layer.

公开(公告)号：US20090086397A1

公开(公告)日：2009-04-02

申请号：US12243113

申请日：2008-10-01

申请人： Kunihiro TAN ,  Masahiro Higashiguchi

发明人： Kunihiro TAN ,  Masahiro Higashiguchi

IPC分类号： H02H5/04

CPC分类号： H01M10/42 ,  H01M10/052 ,  H01M10/425 ,  H01M2200/00

摘要： A protection circuit module for a secondary battery including a wiring substrate including two battery-side external connection terminals provided on a top surface thereof, multiple load-side external connection terminals provided on a back surface opposite the top surface, and at least one cutout or through-hole in the wiring substrate; one or more electronic components provided on the wiring substrate; and two metal plates provided respectively on the two battery-side external connection terminals. The at least one cutout or through-hole is provided at a portion of the wiring substrate in which one of the two metal plates is provided, so that a part of the one of the two metal plates is exposed through the cutout or the through-hole when viewed from the back surface of the wiring substrate.

摘要翻译： 一种用于二次电池的保护电路模块，包括：布线基板，包括设置在其顶表面上的两个电池侧外部连接端子，设置在与顶表面相对的背面上的多个负载侧外部连接端子，以及至少一个切口或 布线基板中的通孔; 设置在布线基板上的一个或多个电子部件; 和分别设置在两个电池侧外部连接端子上的两个金属板。 所述至少一个切口或通孔设置在所述布线基板的设置有所述两个金属板之一的部分处，使得所述两个金属板中的一个的一部分通过所述切口或贯通孔露出， 从布线基板的背面观察孔。

公开(公告)号：US20060113108A1

公开(公告)日：2006-06-01

申请号：US11293337

申请日：2005-12-01

申请人： Kunihiro Tan

发明人： Kunihiro Tan

IPC分类号： H05K1/16

CPC分类号： H05K1/167 ,  H05K3/429 ,  H05K2201/09263 ,  H05K2201/09436 ,  H05K2201/09727

摘要： This patent specification describes a printed wiring board which includes an insulating board, a wiring pattern, and a resistor pattern. The wiring pattern includes a metallic material and is formed on the insulating board in a process step. The resistor pattern includes the metallic material and is formed on the insulating board at a time together with the wiring pattern in the process step of the wiring pattern.

公开(公告)号：US07759950B2

公开(公告)日：2010-07-20

申请号：US11663605

申请日：2006-07-13

申请人： Isao Asano ,  Kunihiro Tan

发明人： Isao Asano ,  Kunihiro Tan

IPC分类号： G01R31/28

CPC分类号： G01R31/2884 ,  H01L2224/16225

摘要： An electronic component device testing apparatus includes first contacts arrayed so that first ends of the first contacts positionally correspond to electrode pads arrayed on a surface of an electronic component device; base electrodes in contact with second ends of the first contacts; and one or more second contacts each being in contact with one of the first contacts at a position which is between the first end and the second end of the one of the first contacts and closer to the first end of the one of the first contacts.

摘要翻译： 一种电子部件装置测试装置，包括：第一触点排列成使得第一触头的第一端部位于电子部件装置的表面上排列的电极焊盘; 基极与第一触点的第二端接触; 以及一个或多个第二触点，每个第二触点在位于第一触点之一的第一端和第二端之间并且更靠近第一触点之一的第一端的位置处与第一触点中的一个接触。