发明申请
US20060113654A1 Package of a semiconductor device with a flexible wiring substrate and method for the same
审中-公开
具有柔性布线基板的半导体器件的封装及其方法
- 专利标题： Package of a semiconductor device with a flexible wiring substrate and method for the same
- 专利标题（中）： 具有柔性布线基板的半导体器件的封装及其方法
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申请号： US11328316申请日： 2006-01-10
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公开(公告)号： US20060113654A1公开(公告)日： 2006-06-01
- 发明人: Joseph Sun , Kuang-Chih Cheng , Ming-Chieh Chen
- 申请人： Joseph Sun , Kuang-Chih Cheng , Ming-Chieh Chen
- 申请人地址： TW Hsin-Chu City
- 专利权人： UNITED MICROELECTRONICS CORP.
- 当前专利权人： UNITED MICROELECTRONICS CORP.
- 当前专利权人地址： TW Hsin-Chu City
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.
公开/授权文献
- US1354303A Speed-controlling mechanism for automobiles 公开/授权日：1920-09-28
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