发明申请
- 专利标题: Wiring substrate for mounting light emitting element
- 专利标题(中): 用于安装发光元件的接线基板
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申请号: US11294539申请日: 2005-12-06
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公开(公告)号: US20060118804A1公开(公告)日: 2006-06-08
- 发明人: Makoto Nagai , Setsuo Yada , Atsushi Uchida
- 申请人: Makoto Nagai , Setsuo Yada , Atsushi Uchida
- 专利权人: NGK SPARK PLUG CO., LTD.
- 当前专利权人: NGK SPARK PLUG CO., LTD.
- 优先权: JPP.2004-353574 20041207
- 主分类号: H01L33/00
- IPC分类号: H01L33/00
摘要:
A wiring substrate for mounting a light emitting element, comprising: a substrate body comprising an insulating material and having a first surface and a back surface; and a cavity being opened into the first surface of said substrate body and having a mounting area for mounting a light emitting element at a bottom face of said cavity, wherein a metallized layer provided along a side face of said cavity and metallized layers provided in said substrate body are provided to continue to each other.
公开/授权文献
- US07683393B2 Wiring substrate for mounting light emitting element 公开/授权日:2010-03-23
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