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公开(公告)号:US07683393B2
公开(公告)日:2010-03-23
申请号:US11294539
申请日:2005-12-06
申请人: Makoto Nagai , Setsuo Yada , Atsushi Uchida
发明人: Makoto Nagai , Setsuo Yada , Atsushi Uchida
CPC分类号: H05K1/183 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/32225 , H05K1/0306 , H05K1/092 , H05K3/246 , H05K3/4614 , H05K3/4629 , H05K3/4697 , H05K2201/0347 , H05K2201/09836 , H05K2201/09981 , H05K2201/10106 , H05K2203/061
摘要: A wiring substrate for mounting a light emitting element, comprising: a substrate body comprising an insulating material and having a first surface and a back surface; and a cavity being opened into the first surface of said substrate body and having a mounting area for mounting a light emitting element at a bottom face of said cavity, wherein a metalized layer provided along a side face of said cavity and metalized layers provided in said substrate body are provided to continue to each other.
摘要翻译: 一种用于安装发光元件的布线基板,包括:基板主体,包括绝缘材料并具有第一表面和后表面; 并且一个空腔被打开到所述基片主体的第一表面中,并且具有用于将发光元件安装在所述空腔的底面的安装区域,其中沿着所述空腔的侧面设置的金属化层和设置在所述腔中的金属化层 衬底本体被设置成彼此连续。
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公开(公告)号:US20060118804A1
公开(公告)日:2006-06-08
申请号:US11294539
申请日:2005-12-06
申请人: Makoto Nagai , Setsuo Yada , Atsushi Uchida
发明人: Makoto Nagai , Setsuo Yada , Atsushi Uchida
IPC分类号: H01L33/00
CPC分类号: H05K1/183 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/32225 , H05K1/0306 , H05K1/092 , H05K3/246 , H05K3/4614 , H05K3/4629 , H05K3/4697 , H05K2201/0347 , H05K2201/09836 , H05K2201/09981 , H05K2201/10106 , H05K2203/061
摘要: A wiring substrate for mounting a light emitting element, comprising: a substrate body comprising an insulating material and having a first surface and a back surface; and a cavity being opened into the first surface of said substrate body and having a mounting area for mounting a light emitting element at a bottom face of said cavity, wherein a metallized layer provided along a side face of said cavity and metallized layers provided in said substrate body are provided to continue to each other.
摘要翻译: 一种用于安装发光元件的布线基板,包括:基板主体,包括绝缘材料并具有第一表面和后表面; 并且腔体被打开到所述基板主体的第一表面中并且具有用于将发光元件安装在所述空腔的底面的安装区域,其中沿着所述腔体的侧面设置的金属化层和设置在所述腔体中的金属化层 衬底本体被设置成彼此连续。
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