发明申请
US20060124228A1 Apparatus and method for manufacturing copper clad laminate with improved peel strength
审中-公开
具有提高剥离强度的覆铜层压板的制造方法
- 专利标题: Apparatus and method for manufacturing copper clad laminate with improved peel strength
- 专利标题(中): 具有提高剥离强度的覆铜层压板的制造方法
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申请号: US11297831申请日: 2005-12-07
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公开(公告)号: US20060124228A1公开(公告)日: 2006-06-15
- 发明人: Sang Lee , Joon Shin , Hyung Park , Geum Yun
- 申请人: Sang Lee , Joon Shin , Hyung Park , Geum Yun
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 优先权: KR10-2004-0106433 20041215
- 主分类号: B29C65/02
- IPC分类号: B29C65/02 ; B32B27/00 ; B29D31/00
摘要:
The present invention relates to an apparatus and method for manufacturing a copper clad laminate, which can achieve a substantial improvement in the peel strength between a thermoplastic liquid crystal polymer and a copper foil. The apparatus comprises: a coating means for thinly coating the surface of a copper foil with a thermoplastic liquid crystal polymer solution; a solvent removal means for drying the coated liquid crystal polymer solution to remove the solvent of the coated solution; and a thermal pressing means for laminating and thermally pressing a thermoplastic liquid crystal polymer film onto the copper foil using heating rolls so as to make a copper clad laminate.
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