发明申请
US20060126293A1 Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths
有权
在冷却剂流动路径之间使用冷却剂流动驱动装置的电子系统的冷却装置
- 专利标题: Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths
- 专利标题(中): 在冷却剂流动路径之间使用冷却剂流动驱动装置的电子系统的冷却装置
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申请号: US11008732申请日: 2004-12-09
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公开(公告)号: US20060126293A1公开(公告)日: 2006-06-15
- 发明人: Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
- 申请人: Levi Campbell , Richard Chu , Michael Ellsworth , Madhusudan Iyengar , Roger Schmidt , Robert Simons
- 申请人地址: US NY Armonk 10504
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk 10504
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a pump in fluid communication with a secondary coolant within a secondary coolant flow path. The secondary fluid flow path is separate from the primary coolant flow path. The flow drive apparatus further includes a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary coolant flow path.
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