公开(公告)号：US20080060373A1

公开(公告)日：2008-03-13

申请号：US11940471

申请日：2007-11-15

申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth Jr. ,  Madhusudan Iyengar ,  Donald Porter ,  Roger Schmidt ,  Robert Simons

发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth Jr. ,  Madhusudan Iyengar ,  Donald Porter ,  Roger Schmidt ,  Robert Simons

IPC分类号： F25D23/12 ,  F16K31/00

CPC分类号： H05K7/20772

摘要： An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of a coolant supply or return line providing liquid coolant to the electronics subsystem. The actuation member is coupled to the isolation valve to automatically translate a linear motion, resulting from insertion of the electronics subsystem into the operational position within the electronics housing, into a rotational motion to open the isolation valve and allow coolant to pass. The actuation mechanism, which operates to automatically close the isolation valve when the liquid cooled electronics subsystem is withdrawn from the operational position, can be employed in combination with a compression valve coupling, with one fitting of the compression valve coupling being disposed serially in fluid communication with the isolation valve.

摘要翻译： 使用隔离阀和致动机构来提供隔离阀组件，冷却剂连接/断开组件，冷却的多叶片电子设备中心及其制造方法。 隔离阀设置在向电子子系统提供液体冷却剂的冷却剂供应或返回管线中的至少一个中。 致动构件联接到隔离阀以自动地将由电子系统子系统插入电子设备外壳内的操作位置而产生的直线运动转换成旋转运动，以打开隔离阀并允许冷却剂通过。 当液体冷却的电子子系统从操作位置退出时，操作以自动关闭隔离阀的致动机构可以与压缩阀联接一起使用，压缩阀联接器的一个配件串联设置为流体连通 与隔离阀。

公开(公告)号：US20050286234A1

公开(公告)日：2005-12-29

申请号：US10880398

申请日：2004-06-29

申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC分类号： H01L23/42 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/42 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/01322

摘要： A thermally conductive composite interface and methods of fabrication are provided for coupling a cooling assembly and at least one electronic device. The interface includes a plurality of thermally conductive contacts for mechanically coupling the cooling assembly and electronic device, and an adhesive material at least partially surrounding the thermally conductive contacts. The thermally conductive contacts are made of a first material, which has a first thermal conductivity, and the adhesive material is a second material, which has a second thermal conductivity, with the first thermal conductivity being greater than the second thermal conductivity. The adhesive material rigidly bonds the cooling assembly and the at least one electronic device together, thereby relieving strain on the plurality of thermally conductive contacts resulting from a coefficient of thermal expansion mismatch between the cooling assembly and the at least one electronic device.

摘要翻译： 提供导热复合界面和制造方法用于联接冷却组件和至少一个电子设备。 接口包括用于机械地联接冷却组件和电子设备的多个导热触头，以及至少部分地围绕导热触头的粘合材料。 导热触头由具有第一导热性的第一材料制成，并且粘合材料是具有第二导热性的第二材料，第一导热率大于第二导热率。 粘合剂材料将冷却组件和至少一个电子设备刚性地结合在一起，从而减轻由冷却组件和至少一个电子设备之间的热膨胀失配系数导致的多个导热触头的应变。

公开(公告)号：US20050280993A1

公开(公告)日：2005-12-22

申请号：US10873432

申请日：2004-06-22

申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Robert Simons ,  Roger Schmidt

发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Robert Simons ,  Roger Schmidt

IPC分类号： H01L23/433 ,  H05K7/20

CPC分类号： H01L23/4336 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： An electronic device cooling assembly and fabrication method are provided which include a manifold with an orifice for injecting a cooling liquid onto a surface to be cooled, and an elastic pin support material with an opening aligned to the orifice of the manifold. Multiple thermally conductive pins are mounted within the support material, extending therefrom, and are sized to physically contact the surface to be cooled. The support material has a thickness and compliance which facilitates thermal interfacing of the pins to the surface by allowing second ends thereof to move vertically and tilt. The second end of each pin has a planar surface which is normal to an axis of the pin, and the support material facilitates the planar surfaces of the second pin ends establishing planar contact with the surface to be cooled, notwithstanding that the surface may be other than planar.

摘要翻译： 提供了一种电子设备冷却组件和制造方法，其包括具有用于将冷却液体喷射到待冷却表面上的孔口的歧管以及具有与歧管孔口对准的开口的弹性销支撑材料。 多个导热销安装在支撑材料内，从其延伸，并且其尺寸设计成物理接触要冷却的表面。 支撑材料具有厚度和顺从性，其通过允许其第二端垂直移动和倾斜来促进销与表面的热接合。 每个销的第二端具有垂直于销的轴线的平坦表面，并且支撑材料有助于第二销端的平面表面与待冷却的表面建立平面接触，尽管表面可以是其他 比平面。

公开(公告)号：US20070121299A1

公开(公告)日：2007-05-31

申请号：US11290756

申请日：2005-11-30

申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  H01L23/473 ,  H01L23/4735 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/00

摘要： A heat transfer apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The heat transfer apparatus includes a thermally conductive base having a main surface, and a plurality of thermally conductive fins extending from the main surface. The thermally conductive fins are disposed to facilitate transfer of heat from the thermally conductive base, which can be a portion of the electronic device or a separate structure coupled to the electronic device. At least some conductive fins are composite structures, each including a first material coated with a second material, wherein the first material has a first thermal conductivity and the second material a second thermal conductivity. In one implementation, the thermally conductive fins are wire-bonded pin-fins, each being a discrete, looped pin-fin separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.

摘要翻译： 提供了一种传热装置和制造方法，用于便于从发热电子装置中除去热量。 传热装置包括具有主表面的导热基底和从主表面延伸的多个导热翅片。 导热翅片设置成有助于传导热量，该热传导基底可以是电子设备的一部分或耦合到电子设备的单独结构。 至少一些导电翅片是复合结构，每个包括涂覆有第二材料的第一材料，其中第一材料具有第一导热性，第二材料具有第二导热性。 在一个实施方案中，导热翅片是引线接合的销翅片，每个是分开的环形销翅片，其分开地引线键合到主表面上，并且间隔小于300微米。

公开(公告)号：US20060126308A1

公开(公告)日：2006-06-15

申请号：US11009935

申请日：2004-12-10

申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons ,  Prabjit Singh

发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons ,  Prabjit Singh

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  F28F3/022 ,  H01L23/433 ,  H01L23/473 ,  H01L2224/78301 ,  H01L2924/10253 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base and disposed to facilitate the transfer of heat from the thermally conductive base. The thermally conductive base can be a portion of the electronic device to be cooled or a separate structure coupled to the electronic device to be cooled. If a separate structure, the thermally conductive base has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of the electronic device. In one implementation, the wire-bonded pin fins are discrete, looped pin fins separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.

摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 冷却装置包括具有基本上平面的主表面的导热基体和与导热基体的主表面引线接合并设置成有助于从导热基底转移热量的多个导热销散热片。 导热基座可以是要冷却的电子设备的一部分或者耦合到要冷却的电子设备的单独的结构。 如果是单独的结构，导热基座的热膨胀系数在电子设备的热膨胀系数的规定范围内。 在一个实施方式中，引线接合销散热片是离散的环形销散热片，其分开地引线键合到主表面，并且间隔小于300微米。

公开(公告)号：US20060126293A1

公开(公告)日：2006-06-15

申请号：US11008732

申请日：2004-12-09

申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/2079

摘要： A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a pump in fluid communication with a secondary coolant within a secondary coolant flow path. The secondary fluid flow path is separate from the primary coolant flow path. The flow drive apparatus further includes a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary coolant flow path.

摘要翻译： 提供冷却剂流动驱动装置，用于便于从耦合到发热电子部件的冷却结构移除热量。 冷却剂流动驱动装置包括与在主冷却剂流动回路内流动的主要冷却剂流体连通的涡轮机，以及与次级冷却剂流动路径内的二级冷却剂流体连通的泵。 次级流体流动路径与主冷却剂流动路径分离。 流动驱动装置还包括在涡轮机和泵之间的磁耦合，其中涡轮机通过磁耦合驱动泵以将二级冷却剂泵送通过次级冷却剂流动路径。

公开(公告)号：US20070121294A1

公开(公告)日：2007-05-31

申请号：US11290757

申请日：2005-11-30

申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： F28F9/007 ,  F28D15/00 ,  F28F7/02 ,  F28F2260/02 ,  H05K7/2079

摘要： A heat exchange assembly for a cooling system, having first and second cooling loops, includes a housing with a first coolant inlet and outlet and a second coolant inlet and outlet, respectively coupling to the first and second cooling loops, and multiple heat exchange elements. Each heat exchange element includes a first set and a second set of coolant flow passages intersecting different pairs of parallel face surfaces of the elements, with the second set of flow passages extending in a transverse direction to the first set of flow passages. The heat exchange elements are disposed within the housing with the first set of flow passages oriented in a first common direction in fluid communication with the first coolant inlet and outlet and the second set of flow passages oriented in a second common direction in fluid communication with the second coolant inlet and outlet of the housing.

公开(公告)号：US20070119569A1

公开(公告)日：2007-05-31

申请号：US11290899

申请日：2005-11-30

申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20772

摘要： A redundant assembly for an air and liquid cooled module is provided. The redundant cooling assembly comprises an air and liquid cooled module having a cold plate in thermal communication with a side attached auxiliary drawer. The auxiliary drawer houses a heat exchanger, a liquid pump with piping such that the heat exchanger, the liquid pump with piping and the cold plate form a closed liquid cooling loop. The auxillary drawer also housing an air moving device such that air can readily pass through the air moving device and the heat exchanger in order to provide air cooling. In one embodiment of the invention, fins are disposed on the cold plate to provide cooling in case the pump or the air moving device or both encounter a failure. In alternate embodiments, multiple pumps and/or multiple air moving devices can be used with or without the cold plate fins to provide redundancies.

摘要翻译： 提供了一种用于空气和液体冷却模块的冗余组件。 冗余冷却组件包括空气和液体冷却模块，其具有与附接辅助抽屉热连通的冷板。 辅助抽屉装有热交换器，液体泵具有管道，使得热交换器，具有管道的液体泵和冷却板形成封闭的液体冷却回路。 辅助抽屉还容纳空气移动装置，使得空气可以容易地通过空气移动装置和热交换器以提供空气冷却。 在本发明的一个实施例中，在泵或空气移动装置或两者都遇到故障的情况下，翅片设置在冷板上以提供冷却。 在替代实施例中，多个泵和/或多个空气移动装置可以使用或不使用冷板翅片来提供冗余。

公开(公告)号：US20060250774A1

公开(公告)日：2006-11-09

申请号：US11124513

申请日：2005-05-06

申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes an integrated coolant inlet and outlet manifold having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a plurality of outlet openings for exhausting coolant after impinging on the surface to be cooled. The inlet orifices and the outlet openings are interspersed in a common surface of the integrated manifold. A plurality of exit openings are also provided on at least one edge surface of the manifold. These exit openings are in fluid communication through the manifold with the outlet openings to facilitate exhausting of coolant through the outlet openings and minimize pressure drop through the manifold. At least one surface plane projection of the at least one edge surface intersects a surface plane projection of the common surface.

摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 冷却装置包括具有多个用于将冷却剂喷射到待冷却表面上的多个入口孔的集成冷却剂入口和出口歧管，以及用于在撞击待冷却表面之后排出冷却剂的多个出口开口。 入口孔和出口开口散布在集成歧管的共同表面中。 多个出口也设置在歧管的至少一个边缘表面上。 这些出口通过歧管与出口开口流体连通，以便冷却剂通过出口开口排出并使通过歧管的压降最小化。 所述至少一个边缘表面的至少一个表面平面突起与所述公共表面的表面平面投影相交。

公开(公告)号：US20060126296A1

公开(公告)日：2006-06-15

申请号：US11008359

申请日：2004-12-09

申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/2079 ,  H05K7/20781

摘要： A cooling apparatus for an electronics assembly having a substrate and one or more electronics devices includes an enclosure sealably engaging the substrate to form a cavity, with the electronics devices and a heat exchange assembly being disposed within the cavity. The heat exchange assembly defines a primary coolant flow path and a separate, secondary coolant flow path. The primary coolant flow path includes first and second chambers in fluid communication, and the secondary flow path includes a third chamber disposed between the first and second chambers. The heat exchange assembly provides a first thermal conduction path between primary coolant in the first chamber and secondary coolant in the third chamber, and a second thermal conduction path between primary coolant in the second chamber and secondary coolant in the third chamber. The heat exchange assembly further includes coolant nozzles to direct primary coolant towards the electronics devices.

摘要翻译： 一种用于具有衬底和一个或多个电子器件的电子组件的冷却装置，包括密封地接合衬底以形成空腔的外壳，电子设备和热交换组件设置在空腔内。 热交换组件限定了主冷却剂流动路径和单独的二次冷却剂流动路径。 主冷却剂流动路径包括流体连通的第一和第二腔室，并且二次流动路径包括设置在第一和第二腔室之间的第三腔室。 热交换组件提供在第一室中的主要冷却剂和第三室中的二次冷却剂之间的第一热传导路径，以及在第二室中的主要冷却剂和第三室中的二次冷却剂之间的第二热传导路径。 热交换组件还包括冷却剂喷嘴以将主冷却剂引向电子设备。