发明申请
- 专利标题： Heat spreader with multiple stacked printed circuit boards
- 专利标题（中）： 具有多层叠印刷电路板的散热器
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申请号： US11023213申请日： 2004-12-22
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公开(公告)号： US20060133043A1公开(公告)日： 2006-06-22
- 发明人: Brent Boudreaux , Shaun Harris , Eric Peterson , Christian Belady , Gary Williams , Stuart Haden
- 申请人： Brent Boudreaux , Shaun Harris , Eric Peterson , Christian Belady , Gary Williams , Stuart Haden
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.
公开/授权文献
- US07345885B2 Heat spreader with multiple stacked printed circuit boards 公开/授权日：2008-03-18
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