Invention Application
- Patent Title: Power core devices and methods of making thereof
- Patent Title (中): 电力核心装置及其制造方法
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Application No.: US11289961Application Date: 2005-11-30
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Publication No.: US20060133057A1Publication Date: 2006-06-22
- Inventor: David McGregor , Daniel Amey , Sounak Banerji , William Borland , Karl Dietz , Attiganal Sreeram
- Applicant: David McGregor , Daniel Amey , Sounak Banerji , William Borland , Karl Dietz , Attiganal Sreeram
- Main IPC: H05K7/06
- IPC: H05K7/06
Abstract:
The present invention relates to a power core comprising: at least one embedded surface mount technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor; and at least one planar capacitor laminate; wherein at least one planar capacitor laminate serves as a low inductance path to supply a charge to at least one embedded SMT discrete chip capacitor; and wherein said embedded SMT discrete chip capacitor is connected in parallel to said planar capacitor laminate.
Public/Granted literature
- US07778038B2 Power core devices and methods of making thereof Public/Granted day:2010-08-17
Information query
