发明申请
- 专利标题： Power core devices and methods of making thereof
- 专利标题（中）： 电力核心装置及其制造方法
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申请号： US11289961申请日： 2005-11-30
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公开(公告)号： US20060133057A1公开(公告)日： 2006-06-22
- 发明人: David McGregor , Daniel Amey , Sounak Banerji , William Borland , Karl Dietz , Attiganal Sreeram
- 申请人： David McGregor , Daniel Amey , Sounak Banerji , William Borland , Karl Dietz , Attiganal Sreeram
- 主分类号： H05K7/06
- IPC分类号： H05K7/06
摘要：
The present invention relates to a power core comprising: at least one embedded surface mount technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor; and at least one planar capacitor laminate; wherein at least one planar capacitor laminate serves as a low inductance path to supply a charge to at least one embedded SMT discrete chip capacitor; and wherein said embedded SMT discrete chip capacitor is connected in parallel to said planar capacitor laminate.
公开/授权文献
- US07778038B2 Power core devices and methods of making thereof 公开/授权日：2010-08-17
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