发明申请
US20060139849A1 Multilayered chip capacitor and printed circuit board having embedded multilayered chip capacitor
有权
多层片式电容器和具有嵌入式多层片式电容器的印刷电路板
- 专利标题: Multilayered chip capacitor and printed circuit board having embedded multilayered chip capacitor
- 专利标题(中): 多层片式电容器和具有嵌入式多层片式电容器的印刷电路板
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申请号: US11288802申请日: 2005-11-29
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公开(公告)号: US20060139849A1公开(公告)日: 2006-06-29
- 发明人: Hee Yoon , Chang Shim , Don Choi , Dong Lee
- 申请人: Hee Yoon , Chang Shim , Don Choi , Dong Lee
- 申请人地址: KR Suwon
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2004-0112412 20041224
- 主分类号: H01G4/228
- IPC分类号: H01G4/228
摘要:
The present invention provides a multilayered chip capacitor (MLCC) comprising internal electrodes and external electrodes formed to be perpendicular to the internal electrodes, whereby parasitic capacitance is reduced, resulting in no parallel resonance frequency effects. In addition, the MLCC has a capacitor structure, which provides a first surface and a second surface formed in a stacking direction of the dielectric layers in the capacitor body as a top surface and a bottom surface. Hence, in the thin capacitors having the same size, the number of internal electrode layers is increased, thereby reducing the ESR and ESL. Further, the PCB having an embedded MLCC is easily manufactured.