发明申请
US20060139849A1 Multilayered chip capacitor and printed circuit board having embedded multilayered chip capacitor 有权
多层片式电容器和具有嵌入式多层片式电容器的印刷电路板

Multilayered chip capacitor and printed circuit board having embedded multilayered chip capacitor
摘要:
The present invention provides a multilayered chip capacitor (MLCC) comprising internal electrodes and external electrodes formed to be perpendicular to the internal electrodes, whereby parasitic capacitance is reduced, resulting in no parallel resonance frequency effects. In addition, the MLCC has a capacitor structure, which provides a first surface and a second surface formed in a stacking direction of the dielectric layers in the capacitor body as a top surface and a bottom surface. Hence, in the thin capacitors having the same size, the number of internal electrode layers is increased, thereby reducing the ESR and ESL. Further, the PCB having an embedded MLCC is easily manufactured.
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