发明申请
- 专利标题： Forming a substrate core with embedded capacitor and structures formed thereby
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申请号： US11260023申请日： 2005-10-26
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公开(公告)号： US20060143887A1公开(公告)日： 2006-07-06
- 发明人: Sriram Srinivasan , John Guzek , Cengiz Palanduz , Victor Prokofiev , Joel Auernheimer
- 申请人： Sriram Srinivasan , John Guzek , Cengiz Palanduz , Victor Prokofiev , Joel Auernheimer
- 主分类号： H01G7/00
- IPC分类号： H01G7/00 ; H01R9/00 ; H01G4/06
摘要：
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.
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