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公开(公告)号：US20060143886A1
公开(公告)日：2006-07-06
申请号：US11027386
申请日：2004-12-30
CPC分类号： H05K1/162 , H01G4/10 , H01G4/1209 , H01G4/33 , H05K3/429 , H05K3/4611 , H05K2201/0175 , H05K2201/0179 , H05K2201/09309 , Y10T29/43 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165
摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.
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2.发明申请Forming a substrate core with embedded capacitor and structures formed thereby 有权形成具有嵌入式电容器的基板芯和由此形成的结构公开(公告)号：US20060146476A1
公开(公告)日：2006-07-06
申请号：US11218357
申请日：2005-09-02
IPC分类号： H01G4/228
CPC分类号： H05K1/162 , H01G4/10 , H01G4/1209 , H01G4/33 , H05K3/429 , H05K3/4611 , H05K2201/0175 , H05K2201/0179 , H05K2201/09309 , Y10T29/43 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165
摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.
摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括通过将第一电介质层附着到薄膜电容器的第二导电层并且将第二电介质层附接到薄膜电容器的第一导电层来形成衬底芯。
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公开(公告)号：US20060143887A1
公开(公告)日：2006-07-06
申请号：US11260023
申请日：2005-10-26
CPC分类号： H05K1/162 , H01G4/10 , H01G4/1209 , H01G4/33 , H05K3/429 , H05K3/4611 , H05K2201/0175 , H05K2201/0179 , H05K2201/09309 , Y10T29/43 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165
摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.
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公开(公告)号：US20060220175A1
公开(公告)日：2006-10-05
申请号：US11096235
申请日：2005-03-31
申请人： John Guzek , Cengiz Palanduz , Victor Prokofiev
发明人： John Guzek , Cengiz Palanduz , Victor Prokofiev
IPC分类号： H01L29/00
CPC分类号： H01L23/49822 , H01G4/236 , H01G4/33 , H01L21/4857 , H01L23/50 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/15312 , H05K1/162 , H05K2201/09309 , H05K2201/09481 , H05K2201/09509 , H05K2201/09518 , H05K2201/09718 , Y10T29/435 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A thin-film capacitor assembly includes two plates that are accessed through deep and shallow vias. The thin-film capacitor assembly is able to be coupled with a spacer and an interposer. The thin-film capacitor assembly is also able to be stacked with a plurality of thin-film capacitor assemblies. The thin-film capacitor assembly is also part of computing system.
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公开(公告)号：US20060065975A1
公开(公告)日：2006-03-30
申请号：US10955944
申请日：2004-09-30
申请人： Larry Mosley , Cengiz Palanduz , Victor Prokofiev
发明人： Larry Mosley , Cengiz Palanduz , Victor Prokofiev
CPC分类号： H01L23/50 , H01L23/49805 , H01L23/49822 , H01L2224/16225 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/15311 , H01L2924/19106 , H05K1/0231 , H05K1/162 , H05K2201/0187 , H05K2201/10378 , H01L2224/0401
摘要： An electronic device includes a material having a first dielectric constant (K) value, and a material having a second dielectric constant (K) value. The first dielectric constant (K) value is lower than the second dielectric constant (K) value. The electronic device also includes input/output connection conductors for transmitting signals to and from a die. The input/output connection conductors are routed through the material of the interposer having the first dielectric constant. The electronic device also includes power connection conductors for delivering power to the die, and ground connection conductors. The power and ground connection conductors are routed through the material having the second dielectric constant.
摘要翻译： 电子器件包括具有第一介电常数（K）值的材料和具有第二介电常数（K）值的材料。 第一介电常数（K）值低于第二介电常数（K）值。 电子设备还包括用于向模具传送信号和从模具传送信号的输入/输出连接导体。 输入/输出连接导体通过具有第一介电常数的插入件的材料布线。 电子设备还包括用于向模具输送功率的电力连接导体和接地连接导体。 电源和接地连接导体穿过具有第二介电常数的材料。
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6.发明申请Delivery regions for power, ground and I/O signal paths in an IC package 有权IC封装中的电源，接地和I / O信号通路的交付区域公开(公告)号：US20050207131A1
公开(公告)日：2005-09-22
申请号：US10804800
申请日：2004-03-19
申请人： Victor Prokofiev , Cengiz Palanduz
发明人： Victor Prokofiev , Cengiz Palanduz
CPC分类号： H05K7/1092 , H01L23/50 , H01L2224/16 , H01L2924/01019 , H01L2924/10253 , H01L2924/15312 , H01L2924/19105 , H01L2924/3011 , H05K1/112 , H05K1/141 , H05K1/147 , H05K2201/09227 , H05K2201/094 , H05K2201/10325 , H05K2201/10689 , H05K2201/10734 , H01L2924/00
摘要： An integrated circuit (IC) package includes a chip carrier and a chip mounted to the chip carrier. The chip carrier has a centrally located power delivery region and a peripherally located input-output (I/O) delivery region disposed in partially surrounding relationship to the power delivery region. Power and ground paths are disposed in the power delivery region and I/O signal paths are disposed in the I/O delivery region.
摘要翻译： 集成电路（IC）封装包括芯片载体和安装到芯片载体的芯片。 芯片载体具有位于中心的电力输送区域和以与电力输送区域部分环绕的关系布置的外围定位的输入输出（I / O）输送区域。 电源和接地路径设置在电力输送区域中，I / O信号路径设置在I / O传送区域中。
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7.发明授权Method of forming a substrate core with embedded capacitor and structures formed thereby 有权用嵌入式电容器形成衬底芯的方法和由此形成的结构公开(公告)号：US09572258B2
公开(公告)日：2017-02-14
申请号：US11027386
申请日：2004-12-30
申请人： Sriram Srinivasan , John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev , Joel A. Auernheimer
发明人： Sriram Srinivasan , John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev , Joel A. Auernheimer
CPC分类号： H05K1/162 , H01G4/10 , H01G4/1209 , H01G4/33 , H05K3/429 , H05K3/4611 , H05K2201/0175 , H05K2201/0179 , H05K2201/09309 , Y10T29/43 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165
摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.
摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括通过将第一电介质层附着到薄膜电容器的第二导电层并且将第二电介质层附接到薄膜电容器的第一导电层来形成衬底芯。
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8.发明授权Forming a substrate core with embedded capacitor and structures formed thereby 有权形成具有嵌入式电容器的基板芯和由此形成的结构公开(公告)号：US07224571B2
公开(公告)日：2007-05-29
申请号：US11218357
申请日：2005-09-02
申请人： Sriram Srinivasan , John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev , Joel A. Auernheimer
发明人： Sriram Srinivasan , John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev , Joel A. Auernheimer
IPC分类号： H01G4/228
CPC分类号： H05K1/162 , H01G4/10 , H01G4/1209 , H01G4/33 , H05K3/429 , H05K3/4611 , H05K2201/0175 , H05K2201/0179 , H05K2201/09309 , Y10T29/43 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165
摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.
摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括通过将第一电介质层附着到薄膜电容器的第二导电层并且将第二电介质层附接到薄膜电容器的第一导电层来形成衬底芯。
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9.发明申请Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same 有权具有集成薄膜电容器的有机衬底，其制造方法以及含有它们的系统公开(公告)号：US20060223226A1
公开(公告)日：2006-10-05
申请号：US11095917
申请日：2005-03-31
申请人： John Guzek , Victor Prokofiev
发明人： John Guzek , Victor Prokofiev
CPC分类号： H05K1/162 , H01G4/236 , H01G4/33 , H01L21/4857 , H01L23/49822 , H01L23/50 , H01L23/642 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/15311 , H01L2924/15312 , H05K1/141 , H05K3/4602 , H05K2201/09309 , H05K2201/09481 , H05K2201/09518 , H05K2201/09718 , H05K2201/10674 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An organic substrate, thin-film capacitor composite includes two plates that are accessed through deep and shallow vias. The organic substrate, thin-film capacitor composite includes integral structure with at least one trace in the organic substrate. The composite is able to be coupled with an interposer. The composite is also part of computing system.
摘要翻译： 有机基板，薄膜电容器复合材料包括通过深和浅通孔访问的两个板。 有机衬底，薄膜电容器复合材料包括在有机衬底中具有至少一个迹线的整体结构。 复合材料能够与插入件耦合。 复合也是计算系统的一部分。
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10.发明授权Delivery regions for power, ground and I/O signal paths in an IC package 有权IC封装中的电源，接地和I / O信号通路的交付区域公开(公告)号：US07209366B2
公开(公告)日：2007-04-24
申请号：US10804800
申请日：2004-03-19
IPC分类号： H05K1/11
CPC分类号： H05K7/1092 , H01L23/50 , H01L2224/16 , H01L2924/01019 , H01L2924/10253 , H01L2924/15312 , H01L2924/19105 , H01L2924/3011 , H05K1/112 , H05K1/141 , H05K1/147 , H05K2201/09227 , H05K2201/094 , H05K2201/10325 , H05K2201/10689 , H05K2201/10734 , H01L2924/00
摘要： An integrated circuit (IC) package includes a chip carrier and a chip mounted to the chip carrier. The chip carrier has a centrally located power delivery region and a peripherally located input-output (I/O) delivery region disposed in partially surrounding relationship to the power delivery region. Power and ground paths are disposed in the power delivery region and I/O signal paths are disposed in the I/O delivery region.
摘要翻译： 集成电路（IC）封装包括芯片载体和安装到芯片载体的芯片。 芯片载体具有位于中心的电力输送区域和以与电力输送区域部分环绕的关系布置的外围定位的输入输出（I / O）输送区域。 电源和接地路径设置在电力输送区域中，I / O信号路径设置在I / O传送区域中。
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