发明申请
- 专利标题: Semiconductor light emitting device and fabrication method thereof
- 专利标题(中): 半导体发光器件及其制造方法
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申请号: US11359480申请日: 2006-02-23
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公开(公告)号: US20060145165A1公开(公告)日: 2006-07-06
- 发明人: Akihiko Ishibashi , Toshiya Yokogawa , Kiyoshi Ohnaka , Susumu Koike
- 申请人: Akihiko Ishibashi , Toshiya Yokogawa , Kiyoshi Ohnaka , Susumu Koike
- 申请人地址: JP Osaka
- 专利权人: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人地址: JP Osaka
- 优先权: JP2002-139609 20020515
- 主分类号: H01L33/00
- IPC分类号: H01L33/00
摘要:
The present invention relates to a semiconductor light emitting device comprising a sapphire substrate 11; a u-GaN layer 12 that is formed on top of the substrate 11 and that comprises a plurality of concave portions 121 formed into band-like shapes with predetermined intervals therebetween; a regrown u-GaN layer 13 formed on the u-Ga layer 12; a layered structure that is formed on the u-GaN layer 13 comprises an n-GaN layer 15, an active layer 16, and a p-GaN layer 19; an n-type electrode 24 formed on the n-GaN layer 15 exposed by removing a potion of the layered structure; and a transparent p-type electrode 20 formed on the p-GaN layer 19, wherein the p-type electrode 20 is an emission detection surface, and an air layer S is formed between the bottom surface of the u-GaN layer 13 and the concave portions 121.
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