发明申请
- 专利标题： Curable composition, underfill, and method
- 专利标题（中）： 可固化组合物，底部填充剂和方法
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申请号： US11368146申请日： 2006-03-03
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公开(公告)号： US20060147719A1公开(公告)日： 2006-07-06
- 发明人: Slawomir Rubinsztajn , John Campbell , Ryan Mills , Ananth Prabhakumar , Sandeep Tanopi , David Gibson , Florian Schattenmann
- 申请人： Slawomir Rubinsztajn , John Campbell , Ryan Mills , Ananth Prabhakumar , Sandeep Tanopi , David Gibson , Florian Schattenmann
- 主分类号： B32B27/38
- IPC分类号： B32B27/38 ; B32B15/02 ; C08K3/22
摘要：
A curable composition is provided, and a method associated therewith. The curable composition may include a curable resin and a finely divided refractory solid. The solid may have a surface area that is greater than about 5 square meters per gram, and a determined density of active surface termination sites per square nanometer of surface area.
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