Abstract:
A construction system includes an insulation member. A metal support member is coupled to a side surface of the insulation member. The metal support member is a substantially C-shaped configuration. The metal support member is inserted over an upper side of the wall panel within processed portions of the insulation member to align with the side surface of the insulation member. An extension member portion of the insulation member provides an extension of the insulation member over an exterior side of the wall panel. An exterior sheath is disposed over the extension member portion of the insulation member and over an exterior side of the wall panel. An interior sheath is disposed over an interior side of the wall panel. The exterior sheath and the interior sheath include magnesium oxide.
Abstract:
Described is a sealing system for use at high pressure. End-face seals minimize the sealing radius and therefore allow various fittings—including known ferrule fittings—to be used in high-pressure systems. End-face seals at such high pressure may require smooth surfaces. In order to reduce cost, an end-face preparation tool forges a dimple into the end face to mechanically deform and smooth the surface.
Abstract:
A wound core assembly for an electrical machine comprising a stack of laminations defining a core having a plurality of poles, the wound core assembly further comprising at least one slot wedge, wherein the slot wedge comprises a first portion arranged between adjacent poles and at least one second portion protruding from the first portion and abutting an end face of the core in the region of at least one of the poles. The at least one second portion may apply axial pressure to the end face to reduce the tendency of the laminations to splay axially outwards.
Abstract:
A wound core assembly for an electrical machine comprising a stack of laminations defining a core having a plurality of poles, the wound core assembly further comprising at least one slot wedge, wherein the slot wedge comprises a first portion arranged between adjacent poles and at least one second portion protruding from the first portion and abutting an end face of the core in the region of at least one of the poles. The at least one second portion may apply axial pressure to the end face to reduce the tendency of the laminations to splay axially outwards.
Abstract:
A packet switch arbitration system and method for arbitration in a packet switch. In one aspect, a method of issuing grants to an ingress port is disclosed in which a first grant request and burst signal are activated at an ingress port having more than one word available for transfer through the switch. A first grant is issued to the ingress port on a first interval. A subsequent grant is issued to the ingress port on a subsequent interval, where the subsequent grant is issued before the ingress port has validated the first grant request.
Abstract:
Embodiments of the invention describe an electrical audio connector assembly used in a variety of applications, such as for connecting audio components for transferring audio signals. For example, microphones may be connected to other electrical components by XLR connectors or a phone line. An electrical audio connector assembly includes an XLR connector or three pins and an RJ connector mounted on opposite ends of a body structure. Three metal binding posts project from the body structure, and are conductively coupled to both the XLR connector and the RJ connector.
Abstract:
A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to a circuit board. Ordinary packaged chips can be employed as the top elements, thereby reducing the cost of the assembly and allowing customization of the assembly by selecting packaged chips. The assembly achieves benefits similar to those obtained with a preassembled stacked chip unit, but without the expense of special handling of the bare dies included in the packaged chips.
Abstract:
An x-ray diffraction technique for measuring a known characteristic of a sample of a material in an in-situ state. The technique includes using an x-ray source for emitting substantially divergent x-ray radiation—with a collimating optic disposed with respect to the fixed source for producing a substantially parallel beam of x-ray radiation by receiving and redirecting the divergent paths of the divergent x-ray radiation. A first x-ray detector collects radiation diffracted from the sample; wherein the source and detector are fixed, during operation thereof, in position relative to each other and in at least one dimension relative to the sample according to a-priori knowledge about the known characteristic of the sample. A second x-ray detector may be fixed relative to the first x-ray detector according to the a-priori knowledge about the known characteristic of the sample, especially in a phase monitoring embodiment of the present invention.
Abstract:
The present invention relates to systems and methods for obtaining optimized EPO dosage regimens for a desired pharmacodynamic/pharmacokinetic response. The system includes choosing one or more EPO dosage regimens, then using a PK/PD model to determine the pharmacodynamic/pharmacokinetic profile of one or more EPO dosage regimens, and finally selecting one of the EPO dosage regimens for administration to achieve the desired pharmacodynamic/pharmacodynamic response based on the EPO profile.
Abstract:
An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.