发明申请
- 专利标题： Method of making a support for light emitting diodes which are interconnected in a three-dimensional environment
- 专利标题（中）： 在三维环境中互连的发光二极管的支撑方法
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申请号： US11286161申请日： 2005-11-22
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公开(公告)号： US20060148116A1公开(公告)日： 2006-07-06
- 发明人: Stephane Richard , Jean-Marc Nicolai
- 申请人： Stephane Richard , Jean-Marc Nicolai
- 优先权： FR0412390 20041122
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
The present invention relates to a method of making supports for light emitting diodes, wherein rigid substrates are used as supports for light emitting diodes, it being proposed, in particular, to render the substrates more fragile in order to make certain zones of a lower layer of the said substrate more flexible so that the substrate is able to deform in the region of the zones thus made flexible, the deformation then taking place without causing the electrical conduction of a top layer, on which the diodes are disposed, to be broken. In one particular embodiment of the invention it is proposed to provide as many rigid substrate plates as there are support planes in the three-dimensional environment, and to connect these various substrate plates together by means of deformable conductive components disposed in accordance with surface mounted component technology