Invention Application
- Patent Title: Sealer and method for its application
- Patent Title (中): 封口机及其应用方法
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Application No.: US10547334Application Date: 2004-04-13
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Publication No.: US20060148927A1Publication Date: 2006-07-06
- Inventor: Katsumi Hirose
- Applicant: Katsumi Hirose
- Applicant Address: JP Tokyo
- Assignee: THE YOKOHAMA RUBBER CO., LTD.
- Current Assignee: THE YOKOHAMA RUBBER CO., LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP2003-108979 20030414
- International Application: PCT/JP04/05243 WO 20040413
- Main IPC: B29C73/00
- IPC: B29C73/00 ; B05D1/12

Abstract:
Disclosed are a sealing material comprises a powdered material into which a rubber base sealing material with a viscosity of 20 to 200 Pa·s/100° C. is pulverized at a temperature lower than, or equal to, a brittle temperature of the rubber base sealing material, and a method of applying the sealing material, which comprising applying the powdered material to a surface, intended to be coated with the powered material, by a spay coating process.
Public/Granted literature
- US07666472B2 Sealing material and method of applying the same Public/Granted day:2010-02-23
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