- 专利标题： Semiconductor apparatus and manufacturing method
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申请号： US11324315申请日： 2006-01-04
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公开(公告)号： US20060151889A1公开(公告)日： 2006-07-13
- 发明人: Ryouichi Kajiwara , Kazutoshi Itou , Hidemasa Kagii , Hiroi Oka , Hiroyuki Nakamura
- 申请人： Ryouichi Kajiwara , Kazutoshi Itou , Hidemasa Kagii , Hiroi Oka , Hiroyuki Nakamura
- 优先权： JP2005-002016 20050107
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L23/28 ; H01L21/48
摘要：
Pb free solder is used in die bonding. A thermal stress reduction plate is disposed between a semiconductor chip and a die pad made of a Cu alloy. The semiconductor chip and the thermal stress reduction plate are joined and the thermal stress reduction plate and the die pad are joined by a joint material of Pb free solder having Sn—Sb—Ag—Cu as its main constituent elements and having a solidus temperature not lower than 270° C. and a liquidus temperature not higher than 400° C. Thus, die bonding can be performed using the Pb free solder without generating any chip crack.
公开/授权文献
- US07528489B2 Semiconductor apparatus and manufacturing method 公开/授权日：2009-05-05
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