发明申请
- 专利标题: Soft thin laminated substrate
- 专利标题(中): 软薄层压基板
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申请号: US11031040申请日: 2005-01-10
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公开(公告)号: US20060154102A1公开(公告)日: 2006-07-13
- 发明人: Chih-Yuan Wang , Heng-Yi Chang , Hui-Yu Chang , Ya-Ling Hsu , Chin-Pei Hwang , Kevin Hsu
- 申请人: Chih-Yuan Wang , Heng-Yi Chang , Hui-Yu Chang , Ya-Ling Hsu , Chin-Pei Hwang , Kevin Hsu
- 主分类号: B21C37/00
- IPC分类号: B21C37/00 ; B21D39/00
摘要:
A soft thin laminated substrate including a plastic substrate, an alloy copper layer overlaid on the plastic substrate and a copper foil overlaid on the alloy copper layer. The alloy copper layer is an alloy of copper metal and at least one of nickel, chromium, manganese, molybdenum, iron and phosphorus. The alloy copper layer serves as a tie-coating of the copper foil, whereby the copper foil can tightly attach to the alloy copper layer to associate with the plastic substrate and form the soft thin laminated substrate.
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