公开(公告)号：US20060154102A1

公开(公告)日：2006-07-13

申请号：US11031040

申请日：2005-01-10

申请人： Chih-Yuan Wang ,  Heng-Yi Chang ,  Hui-Yu Chang ,  Ya-Ling Hsu ,  Chin-Pei Hwang ,  Kevin Hsu

发明人： Chih-Yuan Wang ,  Heng-Yi Chang ,  Hui-Yu Chang ,  Ya-Ling Hsu ,  Chin-Pei Hwang ,  Kevin Hsu

IPC分类号： B21C37/00 ,  B21D39/00

CPC分类号： H05K3/388 ,  C23C14/025 ,  C23C14/20 ,  H05K1/0393 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12556

摘要： A soft thin laminated substrate including a plastic substrate, an alloy copper layer overlaid on the plastic substrate and a copper foil overlaid on the alloy copper layer. The alloy copper layer is an alloy of copper metal and at least one of nickel, chromium, manganese, molybdenum, iron and phosphorus. The alloy copper layer serves as a tie-coating of the copper foil, whereby the copper foil can tightly attach to the alloy copper layer to associate with the plastic substrate and form the soft thin laminated substrate.

摘要翻译： 一种柔软的薄层压基板，包括塑料基板，覆盖在塑料基板上的合金铜层和覆盖在合金铜层上的铜箔。 合金铜层是铜金属和镍，铬，锰，钼，铁和磷中的至少一种的合金。 合金铜层用作铜箔的粘结层，由此铜箔可以紧密地附着在合金铜层上以与塑料基板相连，并形成柔软的薄层压基板。

公开(公告)号：US20070241435A1

公开(公告)日：2007-10-18

申请号：US11580124

申请日：2006-10-13

申请人： Chih-Yuan Wang ,  Heng-Yi Chang ,  Ya-Ling Hsu ,  Yi-Te Lee

发明人： Chih-Yuan Wang ,  Heng-Yi Chang ,  Ya-Ling Hsu ,  Yi-Te Lee

IPC分类号： H01L23/02

CPC分类号： H01L24/10 ,  G02F1/13452 ,  H01L24/13 ,  H01L24/81 ,  H01L33/62 ,  H01L2224/10135 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13311 ,  H01L2224/13316 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/16 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81805 ,  H01L2224/83101 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention includes a substrate with a glass plate, a plurality of oxide wires on the glass plate and a plurality of flip chip bumps on the oxide wires and an integrated circuit chip with a plurality of bump pads. The substrate and the integrated circuit chip are hot pressed with a predetermined bonding pressure and temperature to bond the bump pads to the flip chip bumps respectively by eutectic bonding.

摘要翻译： 本发明包括具有玻璃板的基板，玻璃板上的多个氧化物线和氧化物线上的多个倒装芯片凸块和具有多个凸点焊盘的集成电路芯片。 基板和集成电路芯片以预定的接合压力和温度被热压以分别通过共晶接合将凸块焊接到倒装芯片凸块。

公开(公告)号：US20070076389A1

公开(公告)日：2007-04-05

申请号：US11339697

申请日：2006-01-26

申请人： Chih-Yuan Wang ,  Heng-Yi Chang ,  Ya-Ling Hsu

发明人： Chih-Yuan Wang ,  Heng-Yi Chang ,  Ya-Ling Hsu

IPC分类号： H05K7/00

CPC分类号： H01L24/10 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/28 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81903 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/10674 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

摘要： The present invention provides an electronic device with a conductive connection structure, which has a substrate with conductive media thereon. The conductive media are electrically connected to conductive saliences respectively. These saliences are electrically connected to other electronic devices directly or indirectly. Each of the saliences has a space therein and at least a hollow portion communicated with the space. The spaces provide the saliences with a capacity of deformation. Glue can be filled in the spaces to reinforce the bonding strength.

摘要翻译： 本发明提供一种具有导电连接结构的电子器件，其具有在其上具有导电介质的衬底。 导电介质分别电连接到导电孔。 这些细节直接或间接地与其他电子设备电连接。 每个盐水在其中具有空间，并且至少与该空间连通的中空部分。 这些空间为变形的容量提供了色彩。 可以在空间填充胶水以增强粘结强度。

公开(公告)号：US20050012693A1

公开(公告)日：2005-01-20

申请号：US10621421

申请日：2003-07-18

申请人： Chih-Yuan Wang ,  Yen-Chia Lin ,  Heng-Yi Chang ,  Ya-Ling Hsu ,  Ya-Hui Huang

发明人： Chih-Yuan Wang ,  Yen-Chia Lin ,  Heng-Yi Chang ,  Ya-Ling Hsu ,  Ya-Hui Huang

IPC分类号： G09G3/30

CPC分类号： H05B33/22

摘要： Damping and muffling structure for EL cell includes a transparent substrate, a front electrode layer and a lighting layer. The front electrode layer and lighting layer are sequentially overlaid on the substrate. An inducing layer and at least one conductive layer are laid on the lighting layer. A back electrode layer is laid on the inducing layer. The conductive layer is laid on the lighting layer in such a position as not to affect light emitting of the lighting region. The conductive layer is also laid on at least one side between both the lighting layer and the inducing layer and connected with the back electrode layer to electrically connect the inducing layer with the back electrode layer. The back electrode layer is connected to a grounding electrode, whereby the conductive layer can quickly remove the charge accumulating on the inducing layer.

摘要翻译： 用于EL电池的阻尼和消音结构包括透明基板，前电极层和照明层。 前电极层和发光层顺序地覆盖在基板上。 诱导层和至少一个导电层铺设在照明层上。 背面电极层铺设在诱导层上。 导电层在不影响照明区域的发光的位置上被放置在照明层上。 导电层也被放置在发光层和感应层之间的至少一个侧面上，并与背面电极层连接，以将感应层与背面电极层电连接。 背面电极层连接到接地电极，由此导电层可以快速去除累积在感应层上的电荷。

公开(公告)号：US20070108999A1

公开(公告)日：2007-05-17

申请号：US11595943

申请日：2006-11-13

申请人： Chih-Yuan Wang ,  Heng-Yi Chang

发明人： Chih-Yuan Wang ,  Heng-Yi Chang

IPC分类号： G01R31/02

CPC分类号： G01R31/2889 ,  G09G3/006

摘要： A thin film probe card includes a plate and a plurality of wires on the plate, each of which is electrically connected with at least a thin film probe. A plurality of elastic members are provided between the probes, which absorbs the force of the probes in the test to protect the probes from wear and extend the product life of the probe card.

摘要翻译： 薄膜探针卡包括板和板上的多根电线，每根电线与至少一个薄膜探针电连接。 在探针之间设置有多个弹性构件，其在测试中吸收探针的力以保护探针免受磨损并延长探针卡的产品寿命。

公开(公告)号：US07573277B2

公开(公告)日：2009-08-11

申请号：US11595943

申请日：2006-11-13

申请人： Chih-Yuan Wang ,  Heng-Yi Chang

发明人： Chih-Yuan Wang ,  Heng-Yi Chang

IPC分类号： G01R31/02

CPC分类号： G01R31/2889 ,  G09G3/006

摘要： A thin film probe card includes a plate and a plurality of wires on the plate, each of which is electrically connected with at least a thin film probe. A plurality of elastic members are provided between the probes, which absorbs the force of the probes in the test to protect the probes from wear and extend the product life of the probe card.

摘要翻译： 薄膜探针卡包括板和板上的多根电线，每根电线与至少一个薄膜探针电连接。 在探针之间设置有多个弹性构件，其在测试中吸收探针的力以保护探针免受磨损并延长探针卡的产品寿命。