- 专利标题: Chuck plate assembly with cooling means
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申请号: US11298566申请日: 2005-12-12
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公开(公告)号: US20060154407A1公开(公告)日: 2006-07-13
- 发明人: Sang Han , Sung Lee , Myung Huh , Seok Jeong , Kwan Song , Hee Kang
- 申请人: Sang Han , Sung Lee , Myung Huh , Seok Jeong , Kwan Song , Hee Kang
- 优先权: KR10-2005-0000965 20050105; KR10-2005-0000966 20050105
- 主分类号: H01L21/84
- IPC分类号: H01L21/84 ; H01L21/00
摘要:
The invention provides a chuck plate assembly that includes a shadow mask formed with a predetermined pattern; a shadow mask frame holding the shadow mask and having heat-radiating and cooling functions; a substrate aligned with the shadow mask and onto which deposition materials from a deposition source are deposited; and a chuck plate, attaching the substrate to the shadow mask, that includes a refrigerant circulating duct. The temperature of the substrate is optimized in consideration of the temperature of the shadow mask so that an alignment error due to thermal deformation is minimized. That is, the temperature of the shadow mask itself is prevented from rising, and thereby prevents deformation of the shadow mask due to thermal expansion, which improves the precision of a substrate pattern position.
公开/授权文献
- US07548304B2 Chuck plate assembly with cooling means 公开/授权日:2009-06-16
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