发明申请
- 专利标题： Cooling structure of solid state and formation thereof with integrated package
- 专利标题（中）： 固态冷却结构及其集成封装形成
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申请号： US11221791申请日： 2005-09-09
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公开(公告)号： US20060156737A1公开(公告)日： 2006-07-20
- 发明人: Chun-Kai Liu , Jen-Hau Cheng
- 申请人： Chun-Kai Liu , Jen-Hau Cheng
- 专利权人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 优先权： TW94101165 20050114
- 主分类号： F25B21/02
- IPC分类号： F25B21/02
摘要：
A cooling structure of solid state applied to a heat source has a module of thermoelectric transfer and a module of thermo transfer including two structures of passive cooling connected and attached the module of thermoelectric transfer, respectively. One structure of first structure of passive cooling is near heat source and heat generated by the heat source is transferred to another structure of passive cooling through the one structure passive cooling and the module of thermoelectric transfer when electrical power is employed to the module of thermoelectric transfer.
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