Invention Application
US20060157649A1 Method for non-destructive trench depth measurement using electron beam source and X-ray detection
失效
使用电子束源和X射线检测的非破坏性沟槽深度测量方法
- Patent Title: Method for non-destructive trench depth measurement using electron beam source and X-ray detection
- Patent Title (中): 使用电子束源和X射线检测的非破坏性沟槽深度测量方法
-
Application No.: US11035932Application Date: 2005-01-14
-
Publication No.: US20060157649A1Publication Date: 2006-07-20
- Inventor: Yves Martin , Anthony Santiago , Theodore van Kessel
- Applicant: Yves Martin , Anthony Santiago , Theodore van Kessel
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: H01J37/256
- IPC: H01J37/256 ; G01N23/225
Abstract:
A method (and system) for non-destructive measurement of a depth of a feature in a structure, includes using a scanning electron microscope (SEM) image to navigate to find the feature in an X-ray image, using an electron beam to produce a fluorescent emission in the feature, and using an X-ray count made at a position of the feature in the X-ray image, to determine a depth of the feature.
Public/Granted literature
- US07186977B2 Method for non-destructive trench depth measurement using electron beam source and X-ray detection Public/Granted day:2007-03-06
Information query
