Invention Application
- Patent Title: Stacked semiconductor package having interposing print circuit board
-
Application No.: US11332185Application Date: 2006-01-17
-
Publication No.: US20060157843A1Publication Date: 2006-07-20
- Inventor: Sung-Wook Hwang
- Applicant: Sung-Wook Hwang
- Priority: KR10-2005-0004140 20050117
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A stacked semiconductor package including a number of solder ball pads formed on a lower surface of an interposing print circuit board, which is smaller than that of solder ball pads formed on an upper surface thereof, a pitch of the solder ball pads formed on the lower surface of the interposing print circuit board is greater than a pitch of the solder ball pads formed on the upper interposing print circuit board.
Information query
IPC分类:
