发明申请
US20060160019A1 Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern by using the photoresist composition
失效
光敏树脂，具有感光性树脂的光致抗蚀剂组合物和通过使用光致抗蚀剂组合物形成光致抗蚀剂图案的方法
- 专利标题： Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern by using the photoresist composition
- 专利标题（中）： 光敏树脂，具有感光性树脂的光致抗蚀剂组合物和通过使用光致抗蚀剂组合物形成光致抗蚀剂图案的方法
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申请号： US11333934申请日： 2006-01-17
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公开(公告)号： US20060160019A1公开(公告)日： 2006-07-20
- 发明人: Youn-Kyung Wang , Kyoung-Mi Kim , Young-Ho Kim , Jae-Hyun Kim
- 申请人： Youn-Kyung Wang , Kyoung-Mi Kim , Young-Ho Kim , Jae-Hyun Kim
- 优先权： KR2005-04194 20050117
- 主分类号： G03C1/76
- IPC分类号： G03C1/76
摘要：
In a photosensitive resin, a photoresist composition having the photosensitive resin, and a method of forming a photoresist pattern by using the photoresist, the photosensitive resin includes a blocking group substituted for an acid. The photosensitive resin has a weight-average molecular weight of from about 6,000 up to about 8,000. The photosensitive resin has a blocking ratio of from about 5% up to about 40%.
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