发明申请
- 专利标题: Method for manufacturing semiconductor device
- 专利标题(中): 制造半导体器件的方法
-
申请号: US11305074申请日: 2005-12-19
-
公开(公告)号: US20060161288A1公开(公告)日: 2006-07-20
- 发明人: Shinichi Imai
- 申请人: Shinichi Imai
- 申请人地址: JP Osaka
- 专利权人: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人地址: JP Osaka
- 优先权: JP2005-010154 20050118
- 主分类号: G06F19/00
- IPC分类号: G06F19/00
摘要:
A method for manufacturing a semiconductor device is provided in which it is possible to perform process control taking account of wafer information and to deal with the process control in which a recipe is change from one wafer to another. The method comprises steps of inserting a process control system into the path of a network where a manufacturing execution system (MES) and a manufacturing apparatus are connected with each other by using a LAN, obtaining a process result on the lot of the wafers at a previous step through the use of the process control system to rewrite the process recipe, and transmitting the rewritten process recipe from the process control system to the manufacturing apparatus. Since the method includes the step of obtaining the process result on the lot effected at the previous step as wafer information, it is possible to calculate a control parameter taking account of the state of the wafers. Also, since a process control (APC) system is inserted between the MES and the apparatus, there is no communication between the MES and the APC system, so that a communication burden is reduced, thereby the process control can be performed from one wafer to another.
公开/授权文献
- US07324866B2 Method for manufacturing semiconductor device 公开/授权日:2008-01-29
信息查询