发明申请
- 专利标题: Printed circuit wiring board designing support device, printed circuit board designing method, and its program
- 专利标题(中): 印刷电路布线板设计支援装置,印刷电路板设计方法及其程序
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申请号: US10561195申请日: 2004-06-16
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公开(公告)号: US20060161874A1公开(公告)日: 2006-07-20
- 发明人: Takashi Harada , Takahiro Yaguchi , Akira Wakui , Seishi Eya , Shunsuke Fujimoto
- 申请人: Takashi Harada , Takahiro Yaguchi , Akira Wakui , Seishi Eya , Shunsuke Fujimoto
- 申请人地址: JP TOKYO
- 专利权人: NEC CORPORATION
- 当前专利权人: NEC CORPORATION
- 当前专利权人地址: JP TOKYO
- 优先权: JP2003-170749 20030616
- 国际申请: PCT/JP04/08763 WO 20040616
- 主分类号: G06F17/50
- IPC分类号: G06F17/50 ; G06F9/45
摘要:
A printed circuit wiring board designing support device includes a layout data receiving section receiving printed circuit board layout data through an input/output section, a section for extracting structures of power supply/ground planes, a via hole extracting section for extracting a via hole interconnecting the wirings extending over power supply/ground planes, a capacitor extracting section for extracting a capacitor connected between power supply/ground planes, a distance measuring section for measuring the distance between the via hole and the capacitor, a database where the allowable distance value between the via hole and the capacitor in respect to the distance between the power supply and ground planes is recorded, an examination section for comparing the capacitor/via hole distance with the allowable distance value, and a warning section for issuing a warning when the distance between the via hole and the capacitor is larger than the allowable distance value.
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