发明申请
US20060163207A1 Substrate treating apparatus and substrate treating method using the same
审中-公开
基板处理装置及使用其的基板处理方法
- 专利标题: Substrate treating apparatus and substrate treating method using the same
- 专利标题(中): 基板处理装置及使用其的基板处理方法
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申请号: US11184357申请日: 2005-07-18
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公开(公告)号: US20060163207A1公开(公告)日: 2006-07-27
- 发明人: Young-sig Lee , Ki-hyun Kim , Hong-je Cho , Kwan-Tack Lim , Jae-kyeong Lee
- 申请人: Young-sig Lee , Ki-hyun Kim , Hong-je Cho , Kwan-Tack Lim , Jae-kyeong Lee
- 优先权: KR10-2004-0055951 20040719; KR10-2005-0007483 20050127; KR10-2005-0013487 20050218
- 主分类号: B05D7/00
- IPC分类号: B05D7/00 ; C03C15/00 ; B05C5/00 ; C23F1/00 ; B05D1/02
摘要:
Disclosed is a substrate treating apparatus including a treatment solution dispenser supplying a treatment solution on a substrate, a transporting unit transporting the substrate, and a controller controlling the transporting unit so that the substrate is transported in an inclined position. The substrate is inclined sideways through a rotation with respect to an axis extending parallel to a transportation direction of the substrate. The rotation may be made in both directions in an alternating manner. The apparatus is useful for treating the substrate uniformly regardless of substrate size.
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