发明申请
US20060163638A1 Semiconductor device and method for fabricating the same 审中-公开
半导体装置及其制造方法

  • 专利标题: Semiconductor device and method for fabricating the same
  • 专利标题(中): 半导体装置及其制造方法
  • 申请号: US11189916
    申请日: 2005-07-27
  • 公开(公告)号: US20060163638A1
    公开(公告)日: 2006-07-27
  • 发明人: Satoru Ito
  • 申请人: Satoru Ito
  • 优先权: JP2005-015579 20050124
  • 主分类号: H01L29/00
  • IPC分类号: H01L29/00 H01L21/8242 H01L27/108 H01L21/44
Semiconductor device and method for fabricating the same
摘要:
A semiconductor device includes a first insulating film formed on a semiconductor substrate; a second insulating film formed on the first insulating film and having a recess corresponding to a capacitor region; a lower electrode formed in the recess; a capacitor dielectric film formed on the lower electrode; and an upper electrode formed on the capacitor dielectric film. The semiconductor device further includes a conductive portion formed in the first insulating film and the second insulating film for electrically connecting the semiconductor substrate to the upper electrode.
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