发明申请
- 专利标题: Semiconductor device and method for fabricating the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US11336970申请日: 2006-01-23
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公开(公告)号: US20060170117A1公开(公告)日: 2006-08-03
- 发明人: Nobuyuki Tamura , Takehisa Kishimoto , Mizuki Segawa
- 申请人: Nobuyuki Tamura , Takehisa Kishimoto , Mizuki Segawa
- 优先权: JP2005-025329 20050201
- 主分类号: H01L27/088
- IPC分类号: H01L27/088
摘要:
A semiconductor device includes a transistor of a first conductivity type and a transistor of a second conductivity type. The transistor of the first conductivity type includes a first gate portion formed on a first region of a semiconductor substrate, a first sidewall formed on each side face of the first gate portion, a first protecting film formed between the first sidewall and the first gate portion, and an extension diffusion layer of the first conductivity type. The transistor of the second conductivity type includes a second gate portion formed on a second region of the semiconductor substrate, a second sidewall formed on each side face of the second gate portion, a second protecting film having an L-shaped cross-section and formed between the second sidewall and the second gate portion and between the second sidewall and the semiconductor substrate, and an extension diffusion layer of the second conductivity type.
公开/授权文献
- US07271414B2 Semiconductor device and method for fabricating the same 公开/授权日:2007-09-18
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